Cypress CY62136VN Thermal Resistance, AC Test Loads and Waveforms, Data Retention Characteristics , Data Retention Waveform

CY62136VN MoBL®

Document #: 001-06510 Rev. *A Page 4 of 12

Thermal Resistance[6]

Parameter Description Test Conditions TSOPII FBGA Unit

ΘJA Thermal Resistance

(Junction to Ambient) Still Air, soldered on a 4.25 x 1.125 inch,

4-layer printed circuit board 60 55 °C/W

ΘJC Thermal Resistance

(Junction to Case) 22 16 °C/W

AC Test Loads and Waveforms

Parameters Value Unit

R1 1105 Ohms

R2 1550 Ohms

RTH 645 Ohms

VTH 1.75 Volts

Data Retention Characteristics (Over the Operating Range)

Parameter Description Conditions[9] Min. Typ.[2] Max. Unit

VDR VCC for Data Retention 1.0 V

ICCDR Data Retention Current VCC = 1.0V, CE > VCC − 0.3V,

VIN > VCC − 0.3V or VIN < 0.3V, 0.5 7.5 µA

tCDR[6] Chip Deselect to Data

Retention Time 0ns

tR[7] Operation Recovery Time 70 ns

VCC Typ

VCC

OUTPUT

30 pF

INCLUDING

JIG AND

SCOPE

GND

90%

10% 90%

10%

OUTPUT V

Equivalent to: THÉ VENIN EQUIVALENT

ALL INPUT PULSES

RTH

VCC

OUTPUT

5 pF

INCLUDING

JIG AND

SCOPE

Rise Time:

1 V/ns Fall Time:

1 V/ns

(a) (b)

(c)

Data Retention Waveform

Note:

7. Full device operation requires linear VCC ramp from VDR to VCC(min) > 100 ms or stable at VCC(min) > 100 ms.

8. No input may exceed VCC + 0.3V

VCC(min.)

tCDR

VDR>1.0 V

DATA RETENTION MODE

VCC

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