Cypress CY7C1041DV33 Capacitance6, Thermal Resistance6, AC Test Loads and Waveforms, Fbga, Tsop

CY7C1041DV33

Capacitance[6]

Parameter	Description	Test Conditions	Max	Unit
CIN	Input Capacitance	TA = 25°C, f = 1 MHz, VCC = 3.3V	8	pF
COUT	IO Capacitance		8	pF

Thermal Resistance[6]

Parameter	Description	Test Conditions	FBGA	SOJ	TSOP II	Unit
			Package	Package	Package
ΘJA	Thermal Resistance (Junction	Still Air, soldered on a 3 × 4.5 inch,	27.89	57.91	50.66	°C/W
	to Ambient)	four layer printed circuit board
ΘJC	Thermal Resistance (Junction		14.74	36.73	17.17	°C/W
	to Case)

AC Test Loads and Waveforms

The AC test loads and waveform diagram follows.[7]

10 ns device	Z = 50Ω			3.0V	ALL INPUT PULSES
OUTPUT
				90%		90%
		50 Ω	30 pF*	10%		10%
* CAPACITIVE LOAD CONSISTS		1.5V		GND
OF ALL COMPONENTS OF THE
TEST ENVIRONMENT				Rise Time: 1 V/ns	(b)	Fall Time: 1 V/ns
		(a)

High-Z Characteristics

R 317Ω

3.3V

OUTPUT

5 pF		R2
		351Ω
	(c)

Notes

6.Tested initially and after any design or process changes that may affect these parameters.

7.AC characteristics (except High-Z) are tested using the load conditions shown in AC Test Loads and Waveforms (a). High-Z characteristics are tested for all speeds using the test load shown in (c).

Document #: 38-05473 Rev. *E Page 4 of 13

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