STK15C88

Package Diagrams

14

 

 

 

 

 

 

 

 

 

 

1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Figure 11. 28-Pin (300 mil) SOIC (51-85026)

NOTE :

 

PIN 1 ID

1. JEDEC STD REF MO-119

 

 

 

 

 

 

 

 

 

 

 

 

2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT

 

 

 

 

 

DOES INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE.

 

 

 

 

 

MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE

 

 

 

 

 

 

 

 

 

 

3. DIMENSIONS IN INCHES

MIN.

 

 

 

 

 

 

 

 

 

 

 

0.291[7.39]

 

4. PACKAGE WEIGHT 0.85gms

MAX.

 

 

 

 

0.300[7.62]

 

 

 

 

 

 

 

 

 

 

 

 

 

15

28

 

 

 

 

 

 

 

 

0.697[17.70]

0.713[18.11]

 

0.013[0.33]

0.050[1.27]

0.019[0.48]

TYP.

 

0.394[10.01] * 0.419[10.64]

0.026[0.66]

0.032[0.81]

SEATING PLANE

0.092[2.33]

0.105[2.67]

0.004[0.10] 0.004[0.10] * 0.0118[0.30]

PART #

S28.3 STANDARD PKG.

SZ28.3 LEAD FREE PKG.

0.015[0.38]

0.050[1.27]

0.0091[0.23]

0.0125[3.17]

*

51-85026-*D

51 85127 *A

Document Number: 001-50593 Rev. **

Page 13 of 15

[+] Feedback

Page 13
Image 13
Cypress STK15C88 manual Package Diagrams, Pin 300 mil Soic