STK22C48
Document Number: 001-51000 Rev. ** Page 13 of 14
Package Diagrams Figure 13. 28-Pin (300 mil) SOIC (51-85026)
Figure 14. 28-Pin (330 mil) SOIC (51-85058)
PIN1 ID
0.291[7.39]
0.300[7.62]
0.394[10.01]
0.419[10.64]
0.050[1.27]
TYP.
0.092[2.33]
0.105[2.67]
0.004[0.10]
0.0118[0.30]
SEATINGPLANE
0.0091[0.23]
0.0125[3.17]
0.015[0.38]
0.050[1.27]
0.013[0.33]
0.019[0.48]
0.026[0.66]
0.032[0.81]
0.697[17.70]
0.713[18.11]
0.004[0.10]
114
15 28
*
*
*
PART#
S28.3 STANDARDPKG.
SZ28.3LEAD FREE PKG.
MIN.
MAX.
NOTE:
1.JEDEC STD REF MO-119
2.BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT
MOLDPROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE
3.DIMENSIONS IN INCHES
4.PACKAGE WEIGHT 0.85gms
DOESINCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE.
51-85026-*D
51-85058-*A
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