REFRIGERANT PROCESSING

WARNING!

It is illegal to discharge refrigerant into the atmosphere. Use proper reclaiming methods and equipment when installing or servicing this unit.

Finish all pipe connecting before proceeding to charging the system.

Follow the instructions in the outdoor unit for line evacuation, opening service valves, and fi nal charge adjustments. Op- eration charts and charge tables can be found in the EMI Condenser IOMs.

1.Clean the ends of tubing and insert into

ttings.

2.Protect the valves by wrapping with a wet rag "heat sink" before brazing.

Shield

Heat sink

S1C

Shown

5. Attach manifold set.

Manifold

Vaccum Pump

Micron Gage

6.Evacuate line to 500 microns or less to ensure all moisture has been removed and there are no leaks.

S1C

Shown

7.Once certain of a good evacuation and leak free joints, back-seat the valves (counter-clockwise) to open and allow fac- tory charge to fi ll lines and indoor unit.

Refer to Charts in condenser manual to “fi ne tune” the refrigerant charge.

3.We recommend the use of a shield (can be made from some scrap metal) to protect the paint.

4.Braze tubing into fi ttings.

CAC Cassette Evaporator

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EMI CAC manual Refrigerant Processing

CAC specifications

EMI CAC, or Electromagnetic Interference Common-mode Current, is a critical concern in electronic device design and operation. It refers to the unwanted electromagnetic energy that can disrupt the normal functioning of electronic circuits, particularly in complex systems. EMI can arise from various sources, including power lines, radio frequency transmitters, and even other components within the same device.

One of the main features of EMI CAC is its dual nature. It can be both a source of interference and a metric to assess the integrity of electronic systems. The impacts of EMI are far-reaching, affecting communication signals, power supply reliability, and overall device performance. As technology progresses and devices become more compact, the likelihood of EMI issues increases, making it essential for engineers to develop effective solutions.

Several technologies are employed to mitigate EMI CAC in electronic systems. Shielding is one of the most common methods, involving the use of conductive materials to block electromagnetic fields. This can take the form of metal enclosures or coatings that prevent the escape of emissions. Another strategy involves the use of filters, such as ferrite beads and capacitors, which can suppress common-mode currents before they enter the sensitive parts of a circuit.

The characteristics of EMI CAC vary depending on several factors, including frequency, amplitude, and the specific environment in which the electronic devices operate. High-frequency EMI is particularly challenging due to its ability to penetrate enclosures and disrupt signals. Additionally, common-mode noise can often appear in differential signals, exacerbating the situation and making detection more difficult.

Achieving EMC (Electromagnetic Compatibility) is a major goal for designers dealing with EMI CAC. This involves not only reducing emissions from devices but also improving their immunity to external sources of interference. Effective grounding techniques and careful layout planning are crucial in minimizing EMI effects.

In summary, EMI CAC represents a significant challenge in modern electronics, with a need for advanced solutions to ensure device performance and reliability. By understanding its features, employing effective technologies for mitigation, and addressing its characteristics, engineers can create robust designs that thrive in the increasingly complex electromagnetic landscape of today’s technological world.