BLANKING OFF (Optional)

The fascia discharge slot(s) will need blanking off when ducts are used to channel the conditioned air to other areas. The two polystyrene blanking off strips (provided) will need to be positioned in the fascia discharge slots to direct the air to the ducts.

If the fascia discharge slot needs blanking off: 1. Remove the inlet grille(s) and fi lter(s).

The small unit has is one grille and one fi lter.

2.Once the grille(s) and fi lter(s) are re- moved turn the fascia over so the poly- styrene insulation is exposed.

3. Take one of the polystyrene blanking off pieces and push it into the recess in the polystyrene fascia insulation.

Blanking-Off

Pieces

Small

Unit

Shown

Medium units have two hinged grills that open in the middle and two fi lters.

Medium

Unit Shown

Hing

Large Unit

Not Shown

 

The large units have three hinged grills and three fi lters.

NOTE: Up to two non-adjacent sides can be blanked off.

CAC Cassette Evaporator

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EMI CAC manual Small Unit Shown, Medium Unit Shown, Large Unit

CAC specifications

EMI CAC, or Electromagnetic Interference Common-mode Current, is a critical concern in electronic device design and operation. It refers to the unwanted electromagnetic energy that can disrupt the normal functioning of electronic circuits, particularly in complex systems. EMI can arise from various sources, including power lines, radio frequency transmitters, and even other components within the same device.

One of the main features of EMI CAC is its dual nature. It can be both a source of interference and a metric to assess the integrity of electronic systems. The impacts of EMI are far-reaching, affecting communication signals, power supply reliability, and overall device performance. As technology progresses and devices become more compact, the likelihood of EMI issues increases, making it essential for engineers to develop effective solutions.

Several technologies are employed to mitigate EMI CAC in electronic systems. Shielding is one of the most common methods, involving the use of conductive materials to block electromagnetic fields. This can take the form of metal enclosures or coatings that prevent the escape of emissions. Another strategy involves the use of filters, such as ferrite beads and capacitors, which can suppress common-mode currents before they enter the sensitive parts of a circuit.

The characteristics of EMI CAC vary depending on several factors, including frequency, amplitude, and the specific environment in which the electronic devices operate. High-frequency EMI is particularly challenging due to its ability to penetrate enclosures and disrupt signals. Additionally, common-mode noise can often appear in differential signals, exacerbating the situation and making detection more difficult.

Achieving EMC (Electromagnetic Compatibility) is a major goal for designers dealing with EMI CAC. This involves not only reducing emissions from devices but also improving their immunity to external sources of interference. Effective grounding techniques and careful layout planning are crucial in minimizing EMI effects.

In summary, EMI CAC represents a significant challenge in modern electronics, with a need for advanced solutions to ensure device performance and reliability. By understanding its features, employing effective technologies for mitigation, and addressing its characteristics, engineers can create robust designs that thrive in the increasingly complex electromagnetic landscape of today’s technological world.