Carrier Tape Specifications
|
|
|
|
| 12.0 ±0.1 |
|
|
|
|
|
|
| ||
|
|
|
|
|
|
|
|
|
|
|
| |||
4.90 ±0.20 |
| 4.0 ±0.1 |
|
|
|
|
| ±0.05 | ||||||
| Ø1.55 | |||||||||||||
0.30 ±0.05 | 4.0 | ±0.1 |
|
|
|
|
|
|
| 1.75 ±0.10 | ||||
|
|
|
|
|
|
| ||||||||
|
|
|
|
|
|
|
|
| ||||||
|
|
|
|
|
|
|
|
|
|
|
|
| ||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| 7.5 ±0.1 | |
13.2 ±0.2 | 16.0 ±0 | |
±0.20 | ||
10.30 |
0.1 MAX | 10.30 ±0.20 | Ø1.6 ±0.1 |
User Direction of Feed
Reflow Profile
| 300 |
|
|
|
|
|
|
|
|
|
| 215C, |
|
| ||||||
|
|
|
|
|
|
|
|
|
|
|
|
| ||||||||
|
|
|
|
|
|
|
|
|
|
|
|
|
| |||||||
(°C) | 250 |
|
|
|
| 225C peak |
|
|
|
|
|
|
|
|
|
| ||||
|
|
|
|
|
|
|
|
|
|
|
|
|
| |||||||
200 |
|
|
|
|
|
|
|
|
|
|
|
|
|
| ||||||
Temperature |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
150 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| ||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
|
| |||||||
| 100 |
|
|
|
|
|
| Time above 183C, | ||||||||||||
| 50 |
|
|
| Ramp up = 3C/sec |
|
|
|
|
|
|
|
|
|
| |||||
| 0 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| 0 | 0.5 | 1 | 1.5 | 2 | 2.5 | 3 | 3.5 |
| 4 |
|
| 4.5 | |||||||
Time (Minute)
•Peak reflow temperature: 225C (package surface temperature)
•Time of temperature higher than 183C for
•One time soldering reflow is recommended
HCPL-3700 AC/DC to Logic Interface Optocoupler
©2005 Fairchild Semiconductor Corporation | www.fairchildsemi.com |
10 |
