Package Dimensions
Through Hole
0.4" Lead Spacing
HCPL-
PIN 1
ID.
0.270 (6.86)
0.250 (6.35)
0.390 (9.91)
|
|
|
| PIN 1 | |
4 | 3 | 2 | 1 | ID. | |
|
| ||||
|
|
|
|
|
|
0.270 (6.86)
0.250 (6.35)
3700 AC/DC
SEATING PLANE
0.200 (5.08)
0.140 (3.55)
0.022 (0.56)
0.016 (0.41)
0.370 (9.40)
0.070 (1.78)
0.045 (1.14)
0.020 (0.51) MIN
0.154 (3.90)
0.120 (3.05)
0.016 (0.40)
0.008 (0.20)
0.100 (2.54) TYP
15° MAX
0.300 (7.62)
TYP
SEATING PLANE
0.200 (5.08)
0.140 (3.55)
0.022 (0.56)
0.016 (0.41)
5 6 7 8
0.390 (9.91)
0.370 (9.40)
0.070 (1.78)
0.045 (1.14)
0.004 (0.10) MIN
0.154 (3.90)
0.120 (3.05)
0.016 (0.40)
0.008 (0.20)
0.100 (2.54) TYP
0° to 15°
0.400 (10.16)
TYP
to Logic Interface Optocoupler
Surface Mount
0.390 (9.91)
0.370 (9.40)
4 3 2 1
5 6 7 8
PIN 1
ID.
0.270 (6.86)
0.250 (6.35)
Recommended Pad Layout for Surface Mount Leadforms
0.070 (1.78)
0.060 (1.52)
0.100 (2.54)
0.070 (1.78)
0.300 (7.62)
0.295 (7.49)
0.045 (1.14)
0.020 (0.51)
MIN
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
Lead Coplanarity : 0.004 (0.10) MAX
TYP
0.045 [1.14]
0.315 (8.00)
MIN
0.405 (10.30)
MIN
0.016 (0.41)
0.008 (0.20)
0.415 (10.54)
0.030 (0.76)
Note:
All dimensions are in inches (millimeters)
©2005 Fairchild Semiconductor Corporation | www.fairchildsemi.com |
8 |
