Typical Characteristics
FDD6690A
| 10 |
|
|
|
|
| |
(V) |
|
| ID = 12 A |
| VDS = 10V |
| 20V |
|
|
|
|
| |||
|
|
|
|
|
| ||
| 8 |
|
|
|
|
| |
VOLTAGE |
|
|
|
|
|
| |
| 6 |
|
| 15V |
|
| |
|
|
|
|
|
| ||
SOURCE |
| 4 |
|
|
|
|
|
, GATE- |
| 2 |
|
|
|
|
|
GS |
|
|
|
|
| ||
|
|
|
|
|
| ||
V |
|
|
|
|
|
|
|
|
| 0 |
|
|
|
|
|
|
| 0 | 5 | 10 | 15 | 20 | 25 |
Qg, GATE CHARGE (nC)
Figure 7. Gate Charge Characteristics
| 1000 |
|
|
|
(A) | 100 | RDS(ON) LIMIT |
| 100µs |
|
|
| 1ms | |
|
| 10ms |
| |
CURRENT |
|
|
| |
10 |
| 100ms |
| |
|
| 1s |
| |
|
| 10 |
| |
, DRAIN |
|
|
| |
1 |
| DC |
| |
| VGS = 4.5V |
| ||
|
|
| ||
| SINGLE PULSE |
|
| |
D |
|
| ||
I | 0.1 | RθJA = 96oC/W |
|
|
|
|
| ||
|
| TA = 25oC |
|
|
| 0.01 |
|
|
|
| 0.1 | 1 | 10 | 100 |
VDS,
Figure 9. Maximum Safe Operating Area
| 1800 |
|
|
|
| f = 1MHz |
|
|
|
|
|
|
|
| |
|
|
|
|
|
| VGS = 0 V |
|
| 1500 |
|
|
|
|
|
|
(pF) |
|
|
|
| Ciss |
|
|
1200 |
|
|
|
|
|
| |
CAPACITANCE | 900 |
|
|
|
|
|
|
600 |
|
| Coss |
|
|
| |
|
|
|
|
|
| ||
|
|
|
|
|
|
| |
| 300 |
|
|
|
|
|
|
|
| Crss |
|
|
|
|
|
| 0 |
|
|
|
|
|
|
| 0 | 5 | 10 | 15 | 20 | 25 | 30 |
VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 8. Capacitance Characteristics
| 100 |
|
|
|
|
(W) |
|
|
| SINGLE PULSE |
|
|
|
| RθJA = 96°C/W |
| |
POWER | 80 |
|
|
| |
|
| TA = 25°C |
| ||
|
|
|
| ||
|
|
|
|
| |
TRANSIENT | 60 |
|
|
|
|
40 |
|
|
|
| |
PEAK | 20 |
|
|
|
|
P(pk), |
|
|
|
| |
|
|
|
|
| |
| 0 |
|
|
|
|
| 0.01 | 0.1 | 1 | 10 | 100 |
|
|
| t1, TIME (sec) |
|
|
Figure 10. Single Pulse Maximum
Power Dissipation
| TRANSIENT THERMAL RESISTANCE | 1 |
|
|
|
|
|
|
|
|
r(t), NORMALIZED EFFECTIVE |
| D = 0.5 |
|
|
|
|
|
|
| |
| 0.2 |
|
|
|
|
| RθJA(t) = r(t) * RθJA |
| ||
0.1 | 0.1 |
|
|
|
|
| RθJA = 96 °C/W |
| ||
| 0.05 |
|
|
|
|
|
| |||
| 0.02 |
|
|
|
| P(pk) |
| |||
0.01 |
| 0.01 |
|
|
|
| t1 |
| ||
|
|
|
|
|
|
|
| |||
|
|
|
|
|
|
| t2 |
| ||
0.001 |
| SINGLE PULSE |
|
|
|
| TJ - TA = P * RθJA(t) |
| ||
|
|
|
|
| Duty Cycle, D = t1 / t2 |
| ||||
|
|
|
|
|
|
|
| |||
0.0001 |
|
|
|
|
|
|
|
| ||
|
|
|
|
|
|
|
|
|
| |
|
| 0.0001 |
| 0.001 | 0.01 | 0.1 | 1 | 10 | 100 | 1000 |
|
|
|
|
|
|
| t1, TIME (sec) |
|
|
|
Figure 11. Transient Thermal Response Curve
Thermal characterization performed using the conditions described in Note 1b.
Transient thermal response will change depending on the circuit board design.
FDD6690A Rev. EW)