Installation

(2)Unpackaging

a)Use a flat work area. Check that the "This Side Up" sign side is up. Handle the package on soft material such as a rubber mat, not on hard material such as a desk.

b)Be careful not to give excess pressure to the internal unit when removing cushions.

c)Be careful not to give excess pressure to the PCA and interface connector when removing the drive from the Fcell.

d)Never remove any labels from the drive. Never open the disk enclosure for any reason.

(3)Installation/removal/replacement

a)Do not attempt to connect or disconnect connections when power is on.

b)Do not move the drive when power is turned on or until the drive completely stops (for 30 seconds) after power is turned off.

c)Place and keep removed screws and other parts where they will not get lost or damaged.

d)Keep a record of all maintenance work for replacing.

(4)Packaging

a)Store the drive in an antistatic case (Fcell).

b)It is recommended to use the same cushions and packages as those at delivery. If those at delivery cannot be used, use a package with shock absorption so that the drive is free from direct shocks. In this case, fully protect the PCAs and interface connector so that they are not damaged.

(5)Delivery

a)When delivering the drive, provide packaging and do not turn it over.

b)Minimize the delivery distance after unpacking and avoid shocks and vibrations with cushions. For the carrying direction at delivery, use one of the mount allowable directions in Subsection 4.1.2.

(6)Storage

a)Provide moistureproof packaging for storage.

b)The storage environment must satisfy the requirements specified in Subsection 2.1.3 when the drive is not operating.

c)To prevent condensation, avoid sudden changes in temperature.

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Fujitsu MAX3036FC, MAX3073FC, MAX3147FC manual Installation

MAX3147FC, MAX3036FC, MAX3073FC specifications

The Fujitsu MAX3036FC, MAX3073FC, and MAX3147FC are advanced integrated circuits that cater to a variety of high-performance applications, predominantly in the realm of communications and data transmission. Each model comes laden with unique features that help in addressing specific requirements in modern electronic systems.

The MAX3036FC, for instance, stands out due to its robust signal processing capabilities. It is particularly optimized for high-speed data communications, making it an excellent choice for applications that demand minimal latency and high data integrity. This featured IC operates within a wide voltage range, ensuring versatility in different circuit environments. It also adopts technology enabling low power consumption, an essential attribute in battery-operated devices.

In contrast, the MAX3073FC brings a distinct set of features suitable for more specialized applications. Its architecture supports a comprehensive serial data communication framework, making it ideal for designs that utilize various communication protocols, including those in industrial automation and automotive systems. The MAX3073FC supports advanced error correction mechanisms which enhance reliability, ensuring more accurate data transmission even over longer distances.

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