SERVICING PRECAUTIONS

CAUTION: Before servicing instruments covered by this

service data and its supplements and addenda, read and

follow the SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conflict between

the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Guidelines

1.Always unplug the instrument AC power cord from the AC power source before:

a.Removing or reinstalling any component, circuit board, module, or any other instrument assembly.

b.Disconnecting or reconnecting any instrument electrical plug or other electrical connection.

c.Connecting a test substitute in parallel with an electrolytic capacitor in the instrument.

CAUTION: A wrong part substitution or incorrect

polarity installation of electrolytic

capacitors may result in an explosion hazard.

d.Discharging the picture tube anode.

2.Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc.) equipped with a suitable high

voltage probe. Do not test high voltage by “drawing an arc.” The H.V. Distribution Box has an internal 400M0

resistor (bleeder resistor) connected from the high voltage to ground. After power is removed from the instrument the high voltage will discharge through the high voltage bleeder resistor. If the tubes have high voltage after power is removed, then the bleeder resistor is defective or the bleeder ground is disconnected.

3.Discharge the picture tube’s anode at any of the R, G, or B outputs on the H.V. Distribution Box only by (a) first

connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is

connected, and then (b) touch the other end of the insulated clip lead to the picture tube high voltage distribution box R, G, or B output, using an insulated handle to avoid personal contact with high voltage.

4.Do not spray chemicals on or near this instrument or any of its assemblies.

5.Unless specified otherwise in these service data, clean electrical contracts by applying the following mixture to

the contacts with a pipe cleaner, cotton-tipped stick or

comparable nonabrasive applicator: 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%- 99% strength).

CAUTION: This is a flammable mixture. Unless specified otherwise in these service data, lubrication of contacts is not required.

6.Do not defeat any plug/socket B+ voltage interlocks with which instruments covered by this service data might be equipped.

7.Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat- sinks are correctly installed.

8.Always connect the test instrument ground lead to the appropriate instrument chassis ground before connecting the test instrument positive lead. Always remove the test instrument ground lead last.

9.Use with this instrument only the test fixtures specified in this service data.

CAUTION: Do not connect the test fixture ground strap to any heatsink in this instrument.

Electrostatically

Sensitive

(ES)

Devices

 

 

 

 

Some

semiconductor

 

(solid

state)

devices

can

be

damaged

easily

by

static

electricity. Such components

commonly

are

called

Electrostatically

 

Sensitive

(ES) Devices.

Examples

of

typical

ES

devices

are integrated

circuits

and

some field-

effect transistors

and

semiconductor

“chip”

components.

The

following

 

techniques

 

should

be

used

to

help

reduce

the

incidence

of component

damage

caused

by static

electricity.

1. Immediately before handling any semiconductor

component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a

known earth ground. Alternatively, obtain and wear a

commercially available discharging wrist strap device, which should be removed for potential shock reasons prior to applying power to the unit under test.

2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3.Use only a grounded-tip soldering iron to solder or desolder ES devices.

4.Use only can anti-static type solder removal device. Some solder removal devices not classified as “anti-

static” can generate electrical charges sufficient to damage ES device.

5.Do not use freon-propelled chemicals. These can

generate electrical charges sufficient to damage ES devices.

6.Do not remove a replacement ES device from its

protective package until immediately before you are

ready to install it. (Most replacement ES devices are

packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material.)

7.Immediately before removing the protective material from

the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged

replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

Page 6
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Hitachi 50SBX78B, 60SBX78B service manual Servicing Precautions, Immediately before handling any semiconductor

60SBX78B, 50SBX78B specifications

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