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HP BladeSystem Enclosure technologies manual Interconnect options and infrastructure

Models: BladeSystem Enclosure technologies

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HP BladeSystem Enclosure technologies manual Interconnect options and infrastructure

Contents

HP BladeSystem c3000 Enclosure technologies technology brief Abstract Overview of HP BladeSystem c3000 EnclosurePage HP Thermal Logic technologies Active Cool fans HP PARSEC architecture Figure 4. HP BladeSystem c3000 self-sealing enclosure Thermal Logic for the server blade and enclosure Power supplies and enclosure power subsystem HP BladeSystem Power Sizer Pooled power Connecting with no power redundancy configured Interconnect options and infrastructure Figure 9. Diagram of the HP BladeSystem c3000 signal midplane Fabric connectivity and port mapping Several port types are referenced in Figures 12 and Mezzanine 1 and Interconnect Bay Virtual Connect Onboard Administrator Enclosure-based DVD ROMPage Insight Display Command-line interface Onboard Administrator cablingWeb GUI Enclosure link cabling Recommendations Summary Appendix A. Acronyms in text The following acronyms are used in the text of this document Appendix B. Fan, power supply, and device bay population guidelines Table B-1. Power supply placement Number of power suppliesPower supply bays used All power supply bays filledPage 8 half-height server blades with both full-height dividers installed Page For more information Call to actionFor additional information, refer to the resources listed below Send comments about this paper to TechCom@HP.com