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BladeSystem Enclosure technologies
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Recommendations, Summary
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BladeSystem Enclosure technologies
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Onboard Administrator
Command-line interface
HP BladeSystem Power Sizer
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Contents
technology brief
HP BladeSystem c3000 Enclosure technologies
Overview of HP BladeSystem c3000 Enclosure
Abstract
Page
HP Thermal Logic technologies
Active Cool fans
Figure 4. HP BladeSystem c3000 self-sealing enclosure
HP PARSEC architecture
Thermal Logic for the server blade and enclosure
Power supplies and enclosure power subsystem
HP BladeSystem Power Sizer
Pooled power
Connecting with no power redundancy configured
Figure 9. Diagram of the HP BladeSystem c3000 signal midplane
Interconnect options and infrastructure
Fabric connectivity and port mapping
Several port types are referenced in Figures 12 and
Mezzanine 1 and Interconnect Bay
Virtual Connect
Enclosure-based DVD ROM
Onboard Administrator
Page
Insight Display
Onboard Administrator cabling
Command-line interface
Web GUI
Enclosure link cabling
Summary
Recommendations
The following acronyms are used in the text of this document
Appendix A. Acronyms in text
Appendix B. Fan, power supply, and device bay population guidelines
Number of power supplies
Table B-1. Power supply placement
Power supply bays used
All power supply bays filled
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8 half-height server blades with both full-height dividers installed
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Call to action
For more information
For additional information, refer to the resources listed below
Send comments about this paper to TechCom@HP.com
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