Processor/Memory Subsystem

3.2AMD Processors

These systems feature an AMD processor mounted with a heat sink in an AM2+ socket. The mounting socket allows the processor to be easily changed for upgrading.

3.2.1 AMD Processor Overview

The systems covered in this guide support AMD Phenom, Athlon, and Sempron processors.

Key features of these AMD processors include:

Single-, dual-, triple-, or quad-core architecture

Dedicated L2 cache for each core

Integrated DDR2 memory controller

Direct-connect archtitecture for improved performance between the CPU, memory, and I/O

HyperTransport™ technology providing up to 4 GB/s (each direction) in mode 1.0 and up to 7.2 GB/s in mode 3.0

Table 3-1 provides a sample listing of processors supported by these systems.

Table 3-1

Supported Processors (partial listing)

 

 

 

 

 

 

 

AMD

Core

Core

HT bus

L2

L3

Instruction set

Processor

design

Speed

mode

Cache

Cache

support (see note)

 

 

 

 

 

 

 

Phenom X4

quad

2.30 GHz

3.0

512 KB x4

2048 KB

Std. set + SSE4a,

 

 

 

 

 

 

Enhanced 3DNow!

 

 

 

 

 

 

 

Phenom X3

triple

2.40 GHz

3.0

512 KB x3

2048 KB

Std. set + SSE4a,

 

 

 

 

 

 

Enhanced 3DNow!

 

 

 

 

 

 

 

Athlon 64 X2

dual

2.80 GHz

2.0

1024 KB x2

n/a

Std. set + AMD-V

Athlon 64 X2

dual

2.70 GHz

2.0

1024 KB x2

n/a

Std. set + AMD-V

Athlon 64

single

2.40 GHz

2.0

1024 KB

n/a

Std. set

Sempron

single

2.30 GHz

1.0

512 KB

n/a

Std. set

NOTE: Standard (std.) instruction set support includes AMD64, MMX, SSE, SSE2, SSE3, 3DNow!, NX bit, Cool’n’Quiet

3.2.2 Processor Changing/Upgrading

These systems use the AM2+ zero-insertion-force mounting socket. These systems require that the processor use an integrated heatsink/fan assembly.

CAUTION: Attachment of the heatsink to the processor is critical on these systems. Improper attachment of the heatsink will likely result in a thermal condition. Although the system is designed to detect thermal conditions and automatically shut down, such conditions could still result in damage to the processor component. Refer to the applicable Service Reference Guide for processor installation instructions.

CAUTION: These systems can only support a processor with a maximum power consumption (also known as thermal design power (TDP)) of 95 watts. Exceeding this limit can result in system damage and lost data.

 

3-2

www.hp.com

Technical Reference Guide