Processor/Memory Subsystem
3.2AMD Processors
These systems feature an AMD processor mounted with a heat sink in an AM2+ socket. The mounting socket allows the processor to be easily changed for upgrading.
3.2.1 AMD Processor Overview
The systems covered in this guide support AMD Phenom, Athlon, and Sempron processors.
Key features of these AMD processors include:
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■Dedicated L2 cache for each core
■Integrated DDR2 memory controller
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■HyperTransport™ technology providing up to 4 GB/s (each direction) in mode 1.0 and up to 7.2 GB/s in mode 3.0
Table
Table
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AMD | Core | Core | HT bus | L2 | L3 | Instruction set |
Processor | design | Speed | mode | Cache | Cache | support (see note) |
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Phenom X4 | quad | 2.30 GHz | 3.0 | 512 KB x4 | 2048 KB | Std. set + SSE4a, |
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| Enhanced 3DNow! |
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Phenom X3 | triple | 2.40 GHz | 3.0 | 512 KB x3 | 2048 KB | Std. set + SSE4a, |
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| Enhanced 3DNow! |
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Athlon 64 X2 | dual | 2.80 GHz | 2.0 | 1024 KB x2 | n/a | Std. set + |
Athlon 64 X2 | dual | 2.70 GHz | 2.0 | 1024 KB x2 | n/a | Std. set + |
Athlon 64 | single | 2.40 GHz | 2.0 | 1024 KB | n/a | Std. set |
Sempron | single | 2.30 GHz | 1.0 | 512 KB | n/a | Std. set |
NOTE: Standard (std.) instruction set support includes AMD64, MMX, SSE, SSE2, SSE3, 3DNow!, NX bit, Cool’n’Quiet
3.2.2 Processor Changing/Upgrading
These systems use the AM2+
CAUTION: Attachment of the heatsink to the processor is critical on these systems. Improper attachment of the heatsink will likely result in a thermal condition. Although the system is designed to detect thermal conditions and automatically shut down, such conditions could still result in damage to the processor component. Refer to the applicable Service Reference Guide for processor installation instructions.
CAUTION: These systems can only support a processor with a maximum power consumption (also known as thermal design power (TDP)) of 95 watts. Exceeding this limit can result in system damage and lost data.
| www.hp.com | Technical Reference Guide |