
Processor/Memory Subsystem
3.2.2 Processor Upgrading
All models use the LGA775 ZIF (Socket T) mounting socket. These systems require that the processor use an integrated heatsink/fan assembly. A replacement processor must use the same type heatsink/fan assembly as the original to ensure proper cooling.
The processor uses a PLGA775 package consisting of the processor die mounted “upside down” on a PC board. This arrangement allows the heat sink to come in direct contact with the processor die. The heat sink and attachment clip are specially designed provide maximum heat transfer from the processor component.
ïCAUTION: Attachment of the heatsink to the processor is critical on these systems. Improper attachment of the heatsink will likely result in a thermal condition. Although the system is designed to detect thermal conditions and automatically shut down, such a condition could still result in damage to the processor component. Refer to the applicable Service Reference Guide for processor installation instructions.
ïCAUTION: Installing a processor that is not supported by the system board may cause damage to the system board and/or the processor. Processors rated above 95 watts are not recommended.
3.3Memory Subsystem
All models support
✎The DDR SDRAM “PCxxxx” reference designates bus bandwidth (i.e., a
The system board provides three or four DIMM sockets depending on form factor:
■XMM1, channel A
■XMM2, channel A
■XMM3, channel B
■XMM4, channel B (not present inUSDT form factor)
DIMMs do not need to be installed in pairs although installation of pairs (an equal DIMM for each channel) provides the best performance. The XMM1 socket must be populated for proper support of Intel Advanced Management Technology (AMT). The BIOS will detect the DIMM population and set the system accordingly as follows:
■
■
■
| www.hp.com | Technical Reference Guide |