HP Performance Optimized Data Center (POD) 240a manual Grounding pad

The HP POD 240a structural sections, metal raceways, wireways, conduit, boxes, and other external intersystem components must be bonded with grounding conductors per NFPA 70 in accordance with NEC (NA) and IEC (EMEA and APJ).

Bonding of Piping Systems and Exposed Structural Steel must comply with NFPA 70 in accordance with NEC (NA) and IEC (EMEA and APJ).

Feature	Specification
Grounding pad	 A grounding pad is located on the underside of the HP POD 240a at the outside
	corner of each IT section, under the electrical panel.
	 Grounding pads are located inside the HP POD 240a at ceiling level to bond the
	sections together and bond the IT racks.
Grounding lugs	 Grounding lugs cannot be attached to any painted surface.
	 Grounding lugs must be compression-type 2-hole lug
Ground rod system or	Customer must provide an effective grounding system with ground rod or ground well.
ground well

IMPORTANT: Before installing the HP POD 240a, consult your local AHJ for applicable codes and to review site-specific location guidelines. If needed, obtain any necessary permits.

The grounding electrode conductor connections are located on IT sections A and B of the HP POD 240a.The following figure shows the location for one of the IT sections.

Side view shown

Required facility connections 21