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MC509 CDMA LGA manual
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86 pages, 2.6 Mb
HUAWEI MC509 CDMA LGA Module
Hardware Guide
Issue
01
Date
2011
-
04
-
08
Contents
Main
Hardware Guide
Huawei Technologies Co., Ltd.
Copyright Huawei Technologies Co., Ltd. 2011. All rights reserved.
Trademarks and Permissions
Notice
NO WARRANTY
About This Document
History
Summary
Content
Page
Page
1
2
2.1 About This Chapter
2.2 Function Overview
Page
2.3 Circuit Block Diagram
2.4 Application Block Diagram
3
3.1 About This Chapter
3.2 LGA Interface
Page
Page
Page
Page
Page
Page
Page
Page
3.3 Power Interface
3.3.1 Overview
3.3.2 VBAT Interface
3.3.3 VCOIN Interface
Sudden momentary power loss
Real-time clock
Module
(DCE)
3.3.4 Output Power Supply Interface
3.4 Signal Control Interface
3.4.1 Overview
3.4.2 Input Signal Control Pins
Power-On Time Sequence
Page
RESIN_N
3.4.3 Output Signal Control Pin (TBD)
3.4.4 WAKEUP_IN Signal
3.4.5 WAKEUP_OUT Signal
3.5 UART Interface
3.5.1 Overview
3.5.2 Circuit Recommended for the UART Interface
3.6 USB Interface
Page
3.7 UIM Card Interface
3.7.1 Overview
3.7.2 Circuit Recommended for the UIM Card Interface
Page
3.7.3 ESD Protection for the UIM Card Interface
3.8 Audio Interface
3.8.1 Analogue Audio
Page
+
_
+ _
3.8.2 Digital Audio
Primary Mode
3.9 General Purpose I/O Interface
3.10 JTAG Interface
3.11 RF Antenna Interface
3.12 NC Pins
4
4.1 About This Chapter
4.2 Antenna Installation Guidelines
4.3 Operating Frequencies
4.4 Conducted RF Measurement
4.4.1 Test Environment
4.4.2 Test Standards
4.5 Conducted Rx Sensitivity and Tx Power
4.5.1 Conducted Receive Sensitivity
4.6 Antenna Design Requirements
4.6.1 Antenna Design Indicators
Antenna Efficiency
S11 or VSWR
Polarization
Radiation Pattern
Gain and Directivity
4.6.2 Interference
4.6.3 CDMA Antenna Requirements
4.6.4 Radio Test Environment
Passive Tests
Active Tests
5
5.1 About This Chapter
5.2 Extreme Working Conditions
5.3 Working and Storage Temperatures and Humidity
5.4 Electrical Features of Application Interfaces
5.5 Power Supply Features
5.5.1 Input Power Supply
5.5.2 Power Consumption
5.6 Reliability Features
Page
5.7 EMC and ESD Features
6
6.1 About This Chapter
6.2 Dimensions and interfaces
6.3 PCB Pad Design
6.4 Label
6.5 Packing System
7
7.1 About This Chapter
7.2 Environmental Protection Certification and Test
7.2.1 RoHS
SGS RoHS Test
7.2.2 WEEE
7.2.3 PVC-free
7.3 National Compulsory Certification
7.3.1 Product Certification
7.3.2 Importance of Product Certification
7.3.3 Product Certification Test Items
7.3.4 Product Certification Classifications
7.3.5 Certification Modes
7.3.6 Certification Types
CE Certification
FCC Certification
NCC (DGT) Certification
A-Tick Certification
TELEC and JATE Certification (Japan)
IC Certification (Canada)
Chinese Certifications
Page
RoHS, REACH, JGPSSI, and Chinese Environmental Protection
Page
7.3.7 Guide to Product Certification
CE Certification and FCC Certification
IC Certification
NCC Certification
7.4 GCF and PTCRB
7.4.1 GCF Certification
Page
7.4.2 PTCRB Certification
7.4.3 Overall-System Certification
Overall-System GCF Certification
Overall-System PTCRB Certification
GCF and PTCRB Certification
8
8.1 Interference
8.2 Medical Device
8.3 Area with Inflammables and Explosives
8.4 Traffic Security
8.5 Airline Security
8.6 Safety of Children
8.7 Environment Protection
8.8 WEEE Approval
8.10 Laws and Regulations Observance
8.11 Care and Maintenance
8.12 Emergency Call
8.13 Specific Absorption Rate (SAR)
8.14 Regulatory Information
8.14.1 CE Approval (European Union)
8.14.2 FCC Statement
9
Page
10
Abbreviations