Huawei MC509 CDMA LGA 6

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Hardware Guide

Mechanical Specifications

Issue 01 (2011-04-08)

Huawei Proprietary and Confidential

6 Mechanical Specifications

6.1 About This Chapter

This chapter describes the following aspects of the MC509 module:

 Dimensions and interfaces

 PCB Pad Design

 Label

 Packing System

6.2 Dimensions and interfaces

The dimension of MC509 is 30mm (length) × 30mm (width) × 2.6mm (height).

Figure 6-1 shows the dimensions of MC509 in details.

Figure 6-1 Dimensions of MC509

Contents

Main Hardware Guide Huawei Technologies Co., Ltd. Copyright Huawei Technologies Co., Ltd. 2011. All rights reserved. Trademarks and Permissions Notice NO WARRANTY About This Document History Summary Content Page Page 1 2 2.1 About This Chapter 2.2 Function Overview Page 2.3 Circuit Block Diagram 2.4 Application Block Diagram 3 3.1 About This Chapter 3.2 LGA Interface Page Page Page Page Page Page Page Page 3.3 Power Interface 3.3.1 Overview 3.3.2 VBAT Interface 3.3.3 VCOIN Interface Sudden momentary power loss Real-time clock Module (DCE) 3.3.4 Output Power Supply Interface 3.4 Signal Control Interface 3.4.1 Overview 3.4.2 Input Signal Control Pins Power-On Time Sequence Page RESIN_N 3.4.3 Output Signal Control Pin (TBD) 3.4.4 WAKEUP_IN Signal 3.4.5 WAKEUP_OUT Signal 3.5 UART Interface 3.5.1 Overview 3.5.2 Circuit Recommended for the UART Interface 3.6 USB Interface Page 3.7 UIM Card Interface 3.7.1 Overview 3.7.2 Circuit Recommended for the UIM Card Interface Page 3.7.3 ESD Protection for the UIM Card Interface 3.8 Audio Interface 3.8.1 Analogue Audio Page + _ + _ 3.8.2 Digital Audio Primary Mode 3.9 General Purpose I/O Interface 3.10 JTAG Interface 3.11 RF Antenna Interface 3.12 NC Pins 4 4.1 About This Chapter 4.2 Antenna Installation Guidelines 4.3 Operating Frequencies 4.4 Conducted RF Measurement 4.4.1 Test Environment 4.4.2 Test Standards 4.5 Conducted Rx Sensitivity and Tx Power 4.5.1 Conducted Receive Sensitivity 4.6 Antenna Design Requirements 4.6.1 Antenna Design Indicators Antenna Efficiency S11 or VSWR Polarization Radiation Pattern Gain and Directivity 4.6.2 Interference 4.6.3 CDMA Antenna Requirements 4.6.4 Radio Test Environment Passive Tests Active Tests 5 5.1 About This Chapter 5.2 Extreme Working Conditions 5.3 Working and Storage Temperatures and Humidity 5.4 Electrical Features of Application Interfaces 5.5 Power Supply Features 5.5.1 Input Power Supply 5.5.2 Power Consumption 5.6 Reliability Features Page 5.7 EMC and ESD Features 6 6.1 About This Chapter 6.2 Dimensions and interfaces 6.3 PCB Pad Design 6.4 Label 6.5 Packing System 7 7.1 About This Chapter 7.2 Environmental Protection Certification and Test 7.2.1 RoHS SGS RoHS Test 7.2.2 WEEE 7.2.3 PVC-free 7.3 National Compulsory Certification 7.3.1 Product Certification 7.3.2 Importance of Product Certification 7.3.3 Product Certification Test Items 7.3.4 Product Certification Classifications 7.3.5 Certification Modes 7.3.6 Certification Types CE Certification FCC Certification NCC (DGT) Certification A-Tick Certification TELEC and JATE Certification (Japan) IC Certification (Canada) Chinese Certifications Page RoHS, REACH, JGPSSI, and Chinese Environmental Protection Page 7.3.7 Guide to Product Certification CE Certification and FCC Certification IC Certification NCC Certification 7.4 GCF and PTCRB 7.4.1 GCF Certification Page 7.4.2 PTCRB Certification 7.4.3 Overall-System Certification Overall-System GCF Certification Overall-System PTCRB Certification GCF and PTCRB Certification 8 8.1 Interference 8.2 Medical Device 8.3 Area with Inflammables and Explosives 8.4 Traffic Security 8.5 Airline Security 8.6 Safety of Children 8.7 Environment Protection 8.8 WEEE Approval 8.10 Laws and Regulations Observance 8.11 Care and Maintenance 8.12 Emergency Call 8.13 Specific Absorption Rate (SAR) 8.14 Regulatory Information 8.14.1 CE Approval (European Union) 8.14.2 FCC Statement 9 Page 10 Abbreviations