Huawei MC509 CDMA LGA manual Packing System, Nameplate

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Hardware Guide	Mechanical Specifications

Figure 6-3 Nameplate

The picture mentioned above is only for reference.

Make the film according to the drawing.

The silk-screen should be clear, without burrs, and dimension should be accurate.

This nameplate should not be covered by the film.

The material and surface finishing and coatings which used have to make satisfied with the EU WEEE and RoHS directives.

The label must be heated up for 20s~40s and able to endure the high temperature of 260 °C. And the color of the material of the nameplate can’t change.

6.5Packing System

HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum packing into cartons. To get the details about the packing system, please refer to HUAWEI LGA Module Technical Guide for Assembly.

Issue 01 (2011-04-08)	Huawei Proprietary and Confidential	58
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