HUAWEI ME909 Series Mini PCIe Module

 

Hardware Guide

Electrical and Reliability Features

The above values are the average of some test samples.

LTE test condition: 10 MHz bandwidth, QPSK, 1RB when testing max Tx power and full RB when testing 1 dBm or 10 dBm.

5.7Reliability Features

Table‎ 5-11lists the test conditions and results of the reliability of the ME909 module .

Table 5-11Test conditions and results of the reliability of the ME909 module

Item

 

Test Condition

 

Standard

 

 

 

 

 

Low-temperature

 

Temperature: –40ºC±2ºC

 

IEC60068

storage

 

Test duration: 24 h

 

 

 

 

 

 

 

 

 

 

 

High-temperature

 

Temperature: 85ºC±2ºC

 

IEC60068

storage

 

Test duration: 24 h

 

 

 

 

 

 

 

 

 

 

 

Low-temperature

 

Temperature: –20ºC±2ºC

 

IEC60068

working

 

Test duration: 24 h

 

 

 

 

 

 

 

 

 

 

 

High-temperature

 

Temperature: 60ºC±2ºC

 

IEC60068

working

 

Test duration: 24 h

 

 

 

 

 

 

 

 

 

 

 

Damp heat cycling

 

High temperature: 55ºC±2ºC

 

IEC60068

 

 

Low temperature: 25ºC±2ºC

 

 

 

 

Humidity: 95%

 

 

 

 

Repetition times: 4

 

 

 

 

Test duration: 12 h+12 h

 

 

 

 

 

 

 

Temperature shock

 

Low temperature: –40ºC±2ºC

 

IEC60068

 

 

High temperature: 85ºC±2ºC

 

 

 

 

Temperature change interval: < 30s

 

 

 

 

Test duration: 15 min

 

 

 

 

Repetition times: 100

 

 

 

 

 

 

 

Salty fog test

 

Temperature: 35°C

 

IEC60068

 

 

Density of the NaCl solution: 5%±1%

 

 

 

 

Spraying interval: 8 h

 

 

 

 

Duration of exposing the module to

 

 

 

 

the temperature of 35°C: 16 h

 

 

 

 

 

 

 

 

Huawei Proprietary and Confidential

42

Issue 0.1 (2013-06-09)

Copyright © Huawei Technologies Co., Ltd.

 

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Huawei ME909 manual Reliability Features, Test Condition Standard