Application Note

(Includes Differences for 970FX to 970MP)

Preliminary IBM PowerPC® 970MP RISC Microprocessor

AppNote_970FX-MP_Differences_Body.fm.1.0
November 15, 2006
8. Package

Page 23 of 25

Figure 8-1. PowerPC970MP Mechanical Package (Side and Top View) Legend
DATUM A is the center plane of feature labeled DATUM A.
DATUM B is the center plane of feature labeled DATUM B.
3 Unless otherwise specified part is symmetrical about centerlines defined by DATUMs A and B.
4Where not otherwise defined, centerlines indicated are to be interpreted as a datum frame work, established by DATUMS
D, A, and B respectively.
This line defines the approximate boundary configuration of encapsulant as dispensed. For underfill requirements see IBM
Engineering Specification 71X8781 Module Encapsulation Specification.
9The chip’s assembled height (which include silicon thickness and melted C4) for 300mm wafers is: 0.829mm - 0.908mm.
The 300mm silicon thickness is 0.785mm +/- 0.020mm.
1
2
7
Top View
Side View