Application Note
(Includes Differences for 970FX to 970MP)
IBM PowerPC® 970MP RISC Microprocessor Preliminary
8. Package
Page 24 of 25
AppNote_970FX-MP_Differences_Body.fm.1.0
November 15, 2006
Figure 8-2. PowerPC970MP Bottom Surface of CBGA Package (Bottom View) LegendDATUM A is the center plane of feature labeled DATUM A.
DATUM B is the center plane of feature labeled DATUM B.
3 Unless otherwise specified part is symmetrical about centerlines defined by DATUMs A and B.
4Where not otherwise defined, centerlines indicated are to be interpreted as a datum frame work, established by DATUM
D, A, and B, respectively.
This line defines the approximate boundary configuration of encapsulant as dispensed. For underfill requirements see IBM
Engineering Specification 71X8781 Module Encapsulation Specification.
9The chip’s assembled height (which include silicon thickness and melted C4) for 300mm wafers is: 0.829mm - 0.908mm.
The 300mm silicon thickness is 0.785mm +/- 0.020mm.
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