Intel 0.9 manual

Intel ATX

Power Supply Design Guide

Version 0.9

Contents

Page IMPORTANT INFORMATION AND DISCLAIMERS Contents Environmental Requirements Electromagnetic Compatibility Safety Requirements Figures Tables 1. Scope 2. Applicable Documents 3. Electrical Specification 3.1 AC Input Requirements 3.1.1 Input Overcurrent Protection 3.1.2 Inrush Current Limiting 3.1.3 Input Undervoltage 3.1.4 Immunity 3.1.4.2.3 Ring Wave, ANSI C62.45-1992 3.1.4.2.4 Electrostatic Discharge, IEC801-2/IEC1000-4-2 3.1.4.3 Radiated Immunity 3.1.4.3.1 IEC801-3/IEC 3.1.4.3.2 ENV 3.1.4.3.3 Radio Frequency Common Mode, ENV 3.2DC Output Requirements 3.2.1 DC Voltage Regulation 3.2.2Remote Sensing 3.3 Typical Power Distribution 3.3.1 Power Limit 3.3.2 Efficiency 3.3.3 Output Ripple/Noise 3.3.4 Output Transient Response 3.3.5 Capacitive Load 3.3.6 Closed Loop Stability 3.3.7 +5VDC/+3.3VDC Power Sequencing 3.3.8 Voltage Hold-upTime 3.4 Timing / Housekeeping / Control 3.4.1 PWR_OK 3.4.2 PS_ON# 3.4.3 +5VSB 3.4.4 Power-onTime 3.4.5 Risetime 3.4.6 Overshoot at Turn-on/Turn-off 3.4.7 Reset after Shutdown 3.4.8 +5VSB at AC Power Down 3.5 Output Protection 3.5.1 Overvoltage Protection 3.5.2 Short Circuit Protection 3.5.3 No Load Operation 3.5.4 Overcurrent Protection 4. Mechanical Requirements 4.1 Labeling / Marking 4.2Physical Dimensions Page Page 4.3 Airflow / Fan 4.4 AC Connector 4.5 DC Connectors 4.5.1 ATX Main Power Connector 4.5.2 Auxiliary Power Connector (for 250 W and 300 W Configurations) 4.5.3 Peripheral Connector(s) 4.5.4 Floppy Drive Connector 5. Environmental Requirements 5.1 Temperature 5.2 Thermal Shock (Shipping) 5.3 Humidity Altitude 5.6 Random Vibration 5.7 Acoustics 6. Electromagnetic Compatibility 6.1 EMI 6.2 Input Line Current Harmonic Content (Optional) 6.3 Magnetic Leakage Fields 7. Reliability 7.1 Component Derating 7.2Mean Time Between Failures (MTBF) 8. Safety Requirements 8.1 North America 8.2 International 8.3 Proscribed Materials