Intel ATX Power Supply Design Guide
Version 0.9
| 4.4 | AC Connector ........................................................................................................................ | 23 | |
| 4.5 | DC Connectors ...................................................................................................................... | 23 | |
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| 4.5.1 ATX Main Power Connector ..................................................................................... | 24 | |
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| 4.5.2 Auxiliary Power Connector (for 250 W and 300 W Configurations) ......................... | 25 | |
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| 4.5.3 | Peripheral Connector(s)............................................................................................ | 25 |
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| 4.5.4 | Floppy Drive Connector ............................................................................................ | 25 |
5. | Environmental Requirements ........................................................................... | 26 | ||
| 5.1 | Temperature .......................................................................................................................... | 26 | |
| 5.2 | Thermal Shock (Shipping) ..................................................................................................... | 26 | |
| 5.3 | Humidity................................................................................................................................. | 26 | |
| 5.4 | Altitude | ................................................................................................................................... | 26 |
| 5.5 | Mechanical Shock ................................................................................................................. | 26 | |
| 5.6 | Random Vibration.................................................................................................................. | 27 | |
| 5.7 | Acoustics ............................................................................................................................... | 27 | |
6. | Electromagnetic Compatibility ......................................................................... | 28 | ||
| 6.1 | EMI ........................................................................................................................................ | 28 | |
| 6.2 | Input Line Current Harmonic Content (Optional) ................................................................... | 28 | |
| 6.3 | Magnetic Leakage Fields....................................................................................................... | 28 | |
7. | Reliability............................................................................................................ | 29 | ||
| 7.1 | Component Derating ............................................................................................................. | 29 | |
| 7.2 | Mean Time Between Failures (MTBF)................................................................................... | 29 | |
8. | Safety Requirements ......................................................................................... | 30 | ||
| 8.1 | North America........................................................................................................................ | 30 | |
| 8.2 | International ........................................................................................................................... | 31 | |
| 8.3 | Proscribed Materials .............................................................................................................. | 31 | |
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