Intel Lead-free 2LI/Pb-free2LI Board, Intel Desktop Board D945GSEJT Product Guide, Description

Intel Desktop Board D945GSEJT Product Guide

Lead-free 2LI/Pb-free 2LI Board

The electronics industry is transitioning to European Union (EU) Restriction of Hazardous Substances (RoHS)-compliant products. The RoHS legislation restricts the use of six materials. One of these restricted materials is lead. Lead is the most common and problematic of the RoHS restricted materials.

There are exemptions in RoHS that allow the use of lead in some very limited locations in electronic products. Maximum lead concentration values have been established for RoHS-compliant electronic products that allow up to 1000 ppm of lead.

Lead-free/Pb-free is a nickname that is often used (or misused) for RoHS-compliant products. In this case, the term "Lead-free/Pb-free" means that lead has been removed where required by the RoHS legislation but still may exist as an impurity below 1000 ppm.

The term "Lead-free 2LI/Pb-free 2LI" means lead-free second level interconnect (2LI). The balls, leads, or pads used to connect the component to a printed circuit board are lead-free, but the first level interconnect (FLI) is not lead-free. The use of lead in the FLI is acceptable because of the RoHS "flip chip" or "die bump" interconnect exemption.

Intel Desktop Board D945GSEJT is a lead-free second level interconnect product. Table 28 shows the lead-free second level interconnect marks as they appear on the board and accompanying collateral. These marks are based on JEDEC standard J-STD-609, “Marking and Labeling of Components, PCBs and PCBAs to Identify Lead, Lead Free and Other Attributes.”

For more information concerning Intel’s lead-free initiatives, refer to http://www.intel.com/technology/silicon/leadfree.htm.

Table 28. Lead-Free Second Level Interconnect Marks

Description	Mark
This symbol is used to identify
electrical and electronic
assemblies and components in
which the Pb concentration
level in the Desktop Board
substrate and the solder
		or
connections from the board to
the components (second-level
interconnect) is not greater
than 0.1% by weight
(1000 ppm).
		or

66