Intel specifications Intel X18-M/X25-MSATA SSD

Models: X25-M X18-M

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Intel® X18-M/X25-M SATA SSD

Table 14.

Serial ATA Power Pin Definitions for 1.8” Form Factor (Continued)

 

 

 

 

 

Pin

 

Function

Definition

Mating Order1

P6

 

V5

5 V Power. Not connected4

2nd Mate

P7

 

DAS

Device Activity Signal5

2nd Mate

Key

 

Key

NC

NC

 

 

 

 

 

P8

 

Optional

Manufacturing Test Pin6

2nd Mate

P9

 

Optional

Manufacturing Test Pin6

2nd Mate

Notes:

1.All mate sequences assume zero angular offset between connectors.

2.P1 and P2 are internally connected to one another within the device.

3.Ground connectors P3 and P4 may contact before the other 1st mate pins in both the power and signal connectors to discharge ESD in a suitably configure backplane connector.

4.P5 and P6 are not connected internal to the device. The host may put 5V on these pins.

5.The host may ground P7 if it is not used for Device Activity Signal (DAS).

6.P8 and P9 should not be connected by the host.

Table 15.

Serial ATA Power Pin Definitions for 2.5” Form Factor

 

 

 

 

 

 

Pin1

 

Function

Definition

Mating Order

P1

 

Not connected2

(3.3 V Power)

 

P2

 

Not connected2

(3.3 V Power)

 

P3

 

Not connected2

(3.3 V Power. pre-charge)

2nd Mate

P4

 

Ground3, 4

 

1st Mate

P5

 

Ground3

 

1st Mate

P6

 

Ground3

 

1st Mate

P7

 

V53, 5

5 V Power

1st Mate

P8

 

V53, 5

5 V Power

2nd Mate

P9

 

V53, 5

5 V Power

2nd Mate

P10

 

Ground3

 

1st Mate

P11

 

DAS6

Device Activity Signal6

2nd Mate

P12

 

Ground3, 4

 

1st Mate

P13

 

V127

12 V Power. Not used.

2nd Mate

P14

 

V127

12 V Power. Not used.

2nd Mate

P15

 

V127

12 V Power. Not used.

2nd Mate

Notes:

1.All pins are in a single row, with a 1.27 mm (0.050”) pitch.

2.Pins P1, P2 and P3 are connected together, although they are not connected internally to the device. The host may put

3.3V on these pins.

3.The mating sequence are:

the ground pins P4-P6, P10, P12 and the 5v power pin P7.

the signal pins and the rest of the 5V power pins P8-P9.

4.Ground connectors P4 and P12 may contact before the other 1st mate pins in both the power and signal connectors to discharge ESD in a suitably configured backplane connector.

5.Power pins P7, P8,and P9 are internally connected to one another within the device.

6.The host may ground P11 if it is not used for Device Activity Signal (DAS).

7.Pins P13, P14 and P15 are connected together, although they are not connected internally to the device. The host may put 12 V on these pins.

Intel® X18-M/X25-M SATA Solid State Drive

 

Product Manual

February 2009

18

Order Number: 319765-006US

Page 18
Image 18
Intel specifications Intel X18-M/X25-MSATA SSD