Intel®
Table 14. | Serial ATA Power Pin Definitions for 1.8” Form Factor (Continued) | |||
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Pin |
| Function | Definition | Mating Order1 |
P6 |
| V5 | 5 V Power. Not connected4 | 2nd Mate |
P7 |
| DAS | Device Activity Signal5 | 2nd Mate |
Key |
| Key | NC | NC |
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P8 |
| Optional | Manufacturing Test Pin6 | 2nd Mate |
P9 |
| Optional | Manufacturing Test Pin6 | 2nd Mate |
Notes:
1.All mate sequences assume zero angular offset between connectors.
2.P1 and P2 are internally connected to one another within the device.
3.Ground connectors P3 and P4 may contact before the other 1st mate pins in both the power and signal connectors to discharge ESD in a suitably configure backplane connector.
4.P5 and P6 are not connected internal to the device. The host may put 5V on these pins.
5.The host may ground P7 if it is not used for Device Activity Signal (DAS).
6.P8 and P9 should not be connected by the host.
Table 15. | Serial ATA Power Pin Definitions for 2.5” Form Factor |
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Pin1 |
| Function | Definition | Mating Order |
P1 |
| Not connected2 | (3.3 V Power) |
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P2 |
| Not connected2 | (3.3 V Power) |
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P3 |
| Not connected2 | (3.3 V Power. | 2nd Mate |
P4 |
| Ground3, 4 |
| 1st Mate |
P5 |
| Ground3 |
| 1st Mate |
P6 |
| Ground3 |
| 1st Mate |
P7 |
| V53, 5 | 5 V Power | 1st Mate |
P8 |
| V53, 5 | 5 V Power | 2nd Mate |
P9 |
| V53, 5 | 5 V Power | 2nd Mate |
P10 |
| Ground3 |
| 1st Mate |
P11 |
| DAS6 | Device Activity Signal6 | 2nd Mate |
P12 |
| Ground3, 4 |
| 1st Mate |
P13 |
| V127 | 12 V Power. Not used. | 2nd Mate |
P14 |
| V127 | 12 V Power. Not used. | 2nd Mate |
P15 |
| V127 | 12 V Power. Not used. | 2nd Mate |
Notes:
1.All pins are in a single row, with a 1.27 mm (0.050”) pitch.
2.Pins P1, P2 and P3 are connected together, although they are not connected internally to the device. The host may put
3.3V on these pins.
3.The mating sequence are:
•the ground pins
•the signal pins and the rest of the 5V power pins
4.Ground connectors P4 and P12 may contact before the other 1st mate pins in both the power and signal connectors to discharge ESD in a suitably configured backplane connector.
5.Power pins P7, P8,and P9 are internally connected to one another within the device.
6.The host may ground P11 if it is not used for Device Activity Signal (DAS).
7.Pins P13, P14 and P15 are connected together, although they are not connected internally to the device. The host may put 12 V on these pins.
Intel® |
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Product Manual | February 2009 |
18 | Order Number: |