NXP Semiconductors CBT3126 Fig 10. Package outline SOT519-1 (SSOP16)

CBT3126_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 23 October 2008 10 of 15
NXP Semiconductors CBT3126
Quad FET bus switch
Fig 10. Package outline SOT519-1 (SSOP16)
UNIT A1A2A3bpcD
(1) E(1) eH
ELL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.25
0.10 1.55 1.40 0.25 0.31 0.20 0.25 0.18 5.0 4.8 4.0 3.8 0.635 1
6.2
5.8 0.89 0.41 0.18 0.05 8
0
o
o
0.180.2 0.09
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
SOT519-1 99-05-04
03-02-18
(1)
wM
bp
D
HE
E
Z
e
c
vMA
X
A
y
18
16 9
θ
A
A1
A2
Lp
detail X
L
(A )
3
0 2.5 5 mm
scale
SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm SOT519-1
A
max.
1.73