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NXP Semiconductors CBT3126 14. Abbreviations, 15. Revision history

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Product data sheet Rev. 02 — 23 October 2008 13 of 15

NXP Semiconductors CBT3126

Quad FET bus switch

14. Abbreviations15. Revision history

Table 10. Abbreviations

Acronym Description

CDM Charged Device Model

ESD ElectroStatic Discharge

HBM Human Body Model

MM Machine Model

TTL Transistor-Transistor Logic

Table 11. Revision history

Document ID Release date Data sheet status Change notice Supersedes

CBT3126_2 20081023 Product data sheet - CBT3126_1

Modiﬁcations: •Theformat of this data sheet has been redesigned to comply with the new identity guidelines of

NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

•Table 4 “Limiting values” Ptot added.

•Section 10 “Dynamic characteristics” tdis value updated.

CBT3126_1 20011212 Product data sheet - -

Contents

Main 1. General description 2. Features 3. Ordering information CBT3126 Quad FET bus switch Rev. 02 23 October 2008 Product data sheet Product data sheet Rev. 02 23 October 2008 2 of 15 NXP Semiconductors CBT3126 4. Functional diagram [1] Also known as QSOP16. continued Type number Temperature range Packag e Name Description Version Pin numbers are for the 14 pin packages. 5. Pinning information 5.1 Pinning 6. Functional description 5.2 Pin description H = HIGH voltage level; L= LOW voltage level. 7. Limiting values 8. Recommended operating conditions C to +85 40 9. Static characteristics 10. Dynamic characteristics C to +85 40 11. AC waveforms C. NXP Semiconductors CBT3126 Fig 6. Enable and disable times Table 8. Measurement points Input Output V M V M V X V 1.5 V 1.5 V VOL + 0.3 V VOH 0.3 V 12. Test information Fig 7. Test circuit for measuring switching times Product data sheet Rev. 02 23 October 2008 8 of 15 13. Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 Fig 8. Package outline SOT109-1 (SO16) Fig 9. Package outline SOT338-1 (SSOP16) SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 Fig 10. Package outline SOT519-1 (SSOP16) Fig 11. Package outline SOT403-1 (TSSOP16) 18 16 9 TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 NXP Semiconductors CBT3126 SOT763-1 Fig 12. Package outline SOT763-1 (DHVQFN16) 14. Abbreviations 15. Revision history 16. Legal information 16.1 Data sheet status 16.2 Denitions 16.3 Disclaimers 16.4 Trademarks 18. Contents