NXP Semiconductors CBT3126 TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1

CBT3126_2 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 02 — 23 October 2008 11 of 15
NXP Semiconductors CBT3126
Quad FET bus switch
Fig 11. Package outline SOT403-1 (TSSOP16)
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.15
0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.40 0.06 8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT403-1 MO-153 99-12-27
03-02-18
wM
bp
D
Z
e
0.25
18
16 9
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
HE
E
c
vMA
X
A
y
0 2.5 5 mm
scale
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
A
max.
1.1
pin 1 index