Oki BISM2 manual Board to Board Connector, Stacking Height, Hirose Connector general specification

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11. Board to Board Connector

This chapter provides specifications for the 40-pin board-to-board connector which serves as physical interface to the host application. The receptacle assembled on the Module is Hirose type DF12C. Details are available at: http://www.hirose.co.jp/cataloge_hp/e53700036.pdf

11.1Stacking Height

Mating headers from Hirose are available in different stacking heights, allowing the spacing between the BISM2 and carrier pcb to be changed from 3.5mm to 5.0mm.

Item	Part number	Stacking height
Receptacle on	DF12C-40DS-0.5V(86)	3.5 mm – 5 mm
Module
Headers DF12 series	DF12(3.5)-40DP-0.5V(86)	3.5 mm

HRS number

CL537-0007-7-86

CL537-0032-4-86

DF12(4.0)-40DP-0.5V(86)

4.0 mm

CL537-0057-5-86

DF12(5.0)-40DP-0.5V(86)

5.0 mm

CL537-0157-0-86

Notes: The headers listed above are with boss and metal fitting.

Suffix -86 denotes RoHS compliance.

11.2Hirose Connector general specification

Parameter	Specification (40 pin Board to Board connector)
Number of Contacts	40
Quantity delivered	2000 Connectors per Tape & Reel
Voltage	50V
Current Rating	0.5A max per contact
Resistance	0.05 Ohm per contact
Dielectric Withstanding Voltage	500V RMS min
Operating Temperature	-45°C...+125°C
Contact Material	phosphor bronze (surface: gold plated)