Panasonic FP (ABP8) Dimensions, Soldering operations, Setting of the operation object

ABP8

DIMENSIONS

Type I

1.0		3.4
.039		.134
Terminal #3	0.2
	.008

3.4

.134

0.3

.012

CL

													mm inch
		Type II				Recommended PC board pattern
1.0										(Top view)
			0.2
	.039		.008
		Terminal #3				1.1					3.7	1.1
	Terminal #1				Terminal #1	.043					.146		.043
							0.7
							.028
		1.5										1.5
		.059
												.059
					Terminal #2
	Terminal #2			CL		+0.2		dia. hole
						1.3−0
						+		.008	dia. hole
				0.8 dia.		.051−0
				.031 dia.

						0.8 dia.																		Schematic
					.031 dia.
													OP±0.2
									1.2				4.5	±.008										SPST-NO
	OP								.047				.177
																							2.9
	3.3±0.2											FP			TTP
FP	.130±.008	TTP										4.9 max.			3.5	max.						2.3	.114	Terminal #1
										2.3
3.7 max.		2.3	max.									.193			.138							.091		Terminal #3
.146		.091								.	091
																								Terminal #2
																C0.1				0.25	0.15 max.
			C0.1					0.25	0.15 max.												.006
	.004			1.2		±0.05	dia.	.010	.006					.004 1.2±0.05				dia.	.010
														.047			±.002	dia.
				.047±.002 dia.

NOTES

1.Soldering operations

1) For manual soldering;

By using 18W Max. (iron tip temperature: 320°C 608°F Max.) soldering should be completed within 3 seconds.

2) For reflow soldering;

Perform soldering reflow at a peak sur-

face temperature of the PC board not to exceed 245°C 473°F. See the below rec- ommended temperature profile.

		Recommended condition for
°F)	245	reflow temperature profile
	473
C(°	220
Temperature	428
	150
	302
			Preheating	with 30 sec.
			within 2 min.

3)During soldering, care should be taken not to apply excessive stress to the termi- nals as the resulting deformation may cause malfunction. Excessively high sol- der tab temperature and soldering iron wattage should also be avoided as these factors may harm switching performance.

2. Setting of the operation object

In setting the operation object; keep the following distance between the switch bot- tom and the operation object at T.T.P. (To- tal Travel Position)

ABP811161P: 2.3 to 2.9mm

.091 to .114 inch ABP811261P: 3.5 to 4.1mm

.138 to .161 inch

3.Quality Check under Actual Loading Conditions

To assure reliability, check the switch un- der actual loading conditions. Avoid any situation that may adversely affect switch- ing performance.

4.Environment

1)These switches do not have a sealed construction. As such, the construction of the equipment in which the switches are to be installed should be given careful consideration when the switches are to be used in locations where corrosive gases, silicon or other substances which will ad- versely affect the contacts are used, where there is a high concentration of dust or where the switches may be ex- posed to condensation or water. Using switches in locations like these may cause malfunctioning.

2)Avoid using this switch in high-temper- ature, high-humidity or condensation- forming environments and avoid allowing droplets of water to remain on the switch or come into contact with it. These condi- tions may interfere with the performance of the switch (resulting in short-circuiting,

migration, etc.). Use the type with the gold contacts in applications involving trains, aircraft, motor vehicles or medical equip- ment where the switch must satisfy safety and high reliability requirements. Please consult with us for the applications re- quired high reliability.

3)Because the humidity range differs de- pending on the ambient temperature, the humidity range indicated below should be used. Continuous operation of the switch is possible within this range, but continu- ous use near the limit of the range should be avoided.

• This humidity range does not guarantee permanent performance.

				Humidity, %R.H.
		85
		Tolerance range
(Avoid freezing when				(Avoid
used at temperatures				condensation
lower than 0°C 32°F)				when used at
				temperatures
		5		higher than 0°C 32°F)
	–25		0		80
	–13	+32			176
				Temperature, °C °F

141

01/2006