IC Data Sheets
EN 58 Q549.2E LA8.
2009-May-08
8.6 Diagram SSB: Audio B10A, TPA3123D (IC 7D10)
Figure 8-6 Internal block diagram and pin configuration
Block Diagram
Pin Configuration
18440_302_090303.eps
090303
1F
SD
PVCCL
PVCCR
VCLAMP
GAIN1
BYPASS
1F
1F
0.22 F
AGND
}Control
Shutdown
Control
LIN
RIN
BSR
BSL
PGNDR
PGNDL
0.22 F
22 H
22 H
0.68 F
470 F
0.68 F
1F
470 F
GAIN0
AVCC
MUTE
ROUT
LOUT
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
PVCCL
SD
PVCCL
MUTE
LIN
RIN
BYPASS
AGND
AGND
PVCCR
VCLAMP
PVCCR
PGNDL
PGNDL
LOUT
BSL
AVCC
AVCC
GAIN0
GAIN1
BSR
ROUT
PGNDR
PGNDR
TERMINAL
I/O/P DESCRIPTION
24-PIN
NAME (PWP)
Shutdownsignal for IC (low = disabled, high = operational). TTL logic levels with compliance to
SD 2I
AVCC
RIN 6 I Audioinput for right channel
LIN 5 I Audioinput for left channel
GAIN0 18 I Gainselectleast-significant bit. TTL logic levels with compliance to AVCC
GAIN1 17 I Gainselectmost-significant bit. TTL logic levels with compliance to AVCC
Mutesignal for quick disable/enable of outputs (high = outputs switch at 50% duty cycle, low =
MUTE 4 I outputsenabled). TTL logic levels with compliance to AVCC
BSL 21 I/O BootstrapI/O for left channel
PVCCL 1,3 P Powersupply for left-channel H-bridge, not internally connected to PVCCR or AVCC
LOUT 22 O Class-D1/2-H-bridge positive output for left channel
PGNDL 23,24 P Powerground for left-channel H-bridge
VCLAMP 11 P Internallygenerated voltage supply for bootstrap capacitors
BSR 16 I/O BootstrapI/O for right channel
ROUT 15 O Class-D1/2-H-bridge negative output for right channel
PGNDR 13,14 P Powerground for right-channel H-bridge.
PVCCR 10,12 P Powersupply for right-channel H-bridge, not connected to PVCCL or AVCC
AGND 9 P Analogground for digital/analog cells in core
AGND 8 P Analogground for analog cells in core
Referencefor preamplifier inputs. Nominally equal to AVCC/8. Also controls start-up time via
BYPASS 7 O externalcapacitorsizing.
AVCC 19,20 P High-voltageanalog power supply. Not internally connected to PVCCR or PVCCL
Connectto ground. Thermal pad should be soldered down on all applications to properly
Thermalpad Die pad P secure device to printed wiring board.