Philips TFA9843AJ 16. Soldering

Preliminary data sheet Rev. 01 — 28 April 2006 16 of 19

Philips Semiconductors TFA9843AJ

20 W stereo power ampliﬁer with volume control

16. Soldering

This text gives a brief insight to wave, dip and manual soldering. A more in-depth account

of soldering ICs can be found in our

(document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of through-hole mount IC packages

on a printed-circuit board.

Driven by legislation and environmental forces the worldwide use of lead-free solder

pastes is increasing. Typical dwell time of the leads in the wave ranges from

3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb

or Pb-free respectively.

The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic

body must not exceed the speciﬁed maximum storage temperature (Tstg(max)). If the

printed-circuit board has been pre-heated, forced cooling may be necessary immediately

after soldering to keep the temperature within the permissible limit.

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the

seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is

less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is

between 300 °C and 400 °C, contact may be up to 5 seconds.

[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit

board.

[2] For PMFP packages hot bar soldering or manual soldering is suitable.

Table 10. Suitability of through-hole mount IC packages for dipping and wave soldering

methods

Package Soldering method

Dipping Wave

CPGA, HCPGA - suitable

DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable[1]

PMFP[2] - not suitable