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Philips TFA9843AJ 6. Block diagram, 7. Pinning information

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Preliminary data sheet Rev. 01 — 28 April 2006 3 of 19

Philips Semiconductors TFA9843AJ

20 W stereo power ampliﬁer with volume control

6. Block diagram

7. Pinning information

7.1 Pinning

Fig 1. Block diagram

001aae428

VOLUME

CONTROL

SHORT-CIRCUIT

AND

TEMPERATURE

PROTECTION

VREF

0.5VCC

VCC

IN1

IN2

OUT1

OUT2

SVR

CIV

GND

TFA9843AJ

kΩ

Fig 2. Pin conﬁguration

TFA9843AJ

OUT2

CIV

IN1

GND

SVR

OUT1

001aae429

IN2

VCC

Contents

Main 1. General description 2. Features 3. Applications TFA9843AJ Rev. 01 28 April 2006 Preliminary data sheet 20 W stereo power amplier with volume control 20 W stereo power amplier with volume control 4. Quick reference data =25 5. Ordering information =18V; T = 0 V; measured in test circuit of Figure 11; 6. Block diagram TFA9843AJ Fig 2. Pin conguration TFA9843AJ Fig 1. Block diagram 8. Functional description 8.1 Input conguration 8.2 Power amplier 8.2.1 Output power measurement 8.2.2 Headroom 8.3 Mode selection 8.4 Supply voltage ripple rejection 8.5 Built-in protection circuits 9. Limiting values 10. Thermal characteristics 11. Static characteristics =25 12. Dynamic characteristics =18V; T = 0 V; measured in test circuit of Figure 11; Philips Semiconductors TFA9843AJ 4 function of frequency 24 16 20 Philips Semiconductors TFA9843AJ THD = 10 %; RL = 4 ; f = 1 kHz VCC = 18 V; RL = 4 frequency 13. Application information 13.1 Application diagrams TFA9843AJ Fig 11. SE application diagram 13.1.1 Single-ended application 13.1.2 Volume control drive options VC V VC 001aae339 13.2 Printed-circuit board 13.2.1 Layout and grounding 13.2.2 Power supply decoupling 13.3 Thermal behavior and heatsink calculation 14. Test information Fig 16. Junction temperature as a function of supply voltage 14.1 Quality information is applicable. General Quality Specication for Integrated Circuits, SNW-FQ-611 15. Package outline Fig 17. Package outline SOT523-1 (DBS9P) DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad SOT523-1 16. Soldering 16.1 Introduction to soldering through-hole mount packages Data Handbook IC26; Integrated Circuit Packages 16.2 Soldering by dipping or by solder wave 16.3 Manual soldering Page 18. Legal information 18.1 Data sheet status 18.2 Denitions 18.3 Disclaimers 18.4 Trademarks 20. Contents