Rockford Fosgate 40X2 manual DSM Discrete Surface Mount Technology, XCard Internal Crossover

◆DSM (Discrete Surface Mount) Technology

The DSM (Discrete Surface Mount) manufacturing process combines the advantages of both discrete components and integrated circuitry. Rockford Fosgate is the only American amplifier manufacturer to have invested millions into this process. DSM components differ from conventional discrete components in different ways. They are more compact, more rugged, and they efficiently dissipate generated heat. Using them wherever appropriate allows the advantages associated with discrete circuitry to be retained while also providing room for both highly advanced processing features and generous PC board copper paths where needed. Their short lead-out structures allow maximum audio performance and highest signal-to-noise ratios to be obtained in amplifiers of desirable package size without resorting to “amplifier-on-a-chip” shortcuts. These advantages are shown below in Figure 1.

Figure 1

PC

Board

Thru-Hole

Component

SolderSolder

PC

Board

Surface Mount

THE RESULT: Fewer connections, improved reliability, shorter signal paths, superior signal-to-noise ratio and awesome sonic performance.

◆XCard (Internal Crossover)

The Punch and Power amplifiers utilize internal active crossovers. These crossovers have many performance advantages such as using discrete components for exact frequency adjustments which are far superior to potentiometers. Additionally, the XCard can be configured for high-pass, low-pass and full range operation. With slight modifi- cations, many crossover frequencies and slope configurations can be achieved.

THE RESULT: Increased system design flexibility with a precise electronic crossover without the limitations of conventional potenti- ometer designs.

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