SMSC USB3290 manual 15

Small Footprint Hi-Speed USB 2.0 Device PHY with UTMI Interface

Datasheet

Table 6.3 DC Electrical Characteristics: Analog I/O Pins (DP/DM) (Note 6.3) (continued)

PARAMETER		SYMBOL	CONDITIONS	MIN	TYP		MAX	UNITS
High Speed High Level		VHSOH	45Ω load	360			440	mV
Output Voltage (DP/DM
referenced to GND)
High Speed IDLE Level		VOLHS	45Ω load	-10			10	mV
Output Voltage (DP/DM
referenced to GND)
Chirp-J Output Voltage		VCHIRPJ	HS termination resistor	700			1100	mV
(Differential)			disabled, pull-up resistor
			connected. 45Ω load.
Chirp-K Output Voltage		VCHIRPK	HS termination resistor	-900			-500	mV
(Differential)			disabled, pull-up resistor
			connected. 45Ω load.
Leakage Current
OFF-State Leakage Current		ILZ					± 1	uA
Port Capacitance
Transceiver Input Capacitance		CIN	Pin to GND		5		10	pF
Note 6.3 VDD3.3 = 3.0 to 3.6V; VSS = 0V; TA = -40oC to 85oC; unless otherwise specified.
Table 6.4 Dynamic Characteristics: Analog I/O Pins (DP/DM) (Note 6.4)
PARAMETER	SYMBOL		CONDITIONS	MIN	TYP		MAX	UNITS
FS Output Driver Timing
Rise Time	TFSR		CL = 50pF; 10 to 90% of	4		20		ns
			VOH - VOL
Fall Time	TFFF		CL = 50pF; 10 to 90% of	4		20		ns
			VOH - VOL
Output Signal Crossover	VCRS		Excluding the first	1.3		2.0		V
Voltage			transition from IDLE state
Differential Rise/Fall Time	FRFM		Excluding the first	90		111.1		%
Matching			transition from IDLE state
HS Output Driver Timing
Differential Rise Time	THSR			500				ps
Differential Fall Time	THSF			500				ps
Driver Waveform			Eye pattern of Template 1				See
Requirements			in USB 2.0 specification			Figure 6.2
High Speed Mode Timing
Receiver Waveform			Eye pattern of Template 4				See
Requirements			in USB 2.0 specification			Figure 6.2
Data Source Jitter and			Eye pattern of Template 4				See
Receiver Jitter Tolerance			in USB 2.0 specification			Figure 6.2

Note 6.4 VDD3.3 = 3.0 to 3.6V; VSS = 0V; TA = -40oC to 85oC; unless otherwise specified.

SMSC USB3290	15	Revision 1.5 (11-02-07)
	DATASHEET