Sony HCD-RG40, HCD-DX30 specifications Table of Contents, Exploded Views

HCD-DX30/RG40

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body.

During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts.

The flexible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick- up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens.

Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.

This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

Notes on chip component replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be damaged by heat.

Flexible Circuit Board Repairing

•Keep the temperature of soldering iron around 270˚C during repairing.

•Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

•Be careful not to apply force on the conductor when soldering or unsoldering.

TABLE OF CONTENTS

1.SERVICE NOTE ······························································· 4

2.GENERAL ·········································································· 5

3.DISASSEMBLY ································································ 7

4.TEST MODE ···································································· 12

5.ELECTRICAL ADJUSTMENTS ······························· 16

6.DIAGRAMS ······································································ 19

6-1.	Circuit Board Location ················································ 20
6-2.	Block Diagrams Tuner/CD Section ···························· 21
	Main Section ······························································· 22
6-3.	Schematic Diagram	Main Section (1/4) ···················· 23
6-4.	Schematic Diagram	Main Section (2/4) ···················· 24
6-5.	Schematic Diagram	Main Section (3/4) ···················· 25
6-6.	Schematic Diagram	Main Section (4/4) ···················· 26
6-7.	Printed Wiring Board	Main Section ·························· 27
6-8.	Printed Wiring Board	BD Section ····························· 28
6-9.	Schematic Diagram	BD Section ································ 29
6-10. Printed Wiring Board		Power AMP Section ··············· 30
6-11. Schematic Diagram		Power AMP Section ·················· 31
6-12. Printed Wiring Board		Panel Section ·························· 32
6-13. Schematic Diagram		Panel Section ···························· 33
6-14. Printed Wiring Board		Key Section ···························· 34
6-15. Schematic Diagram		Key Section ······························· 35
6-16. Printed Wiring Board		Driver Section ························ 36
6-17. Schematic Diagram		Driver Section ··························· 37
6-18. Printed Wiring Board		Trans Section ·························· 38
6-19. Schematic Diagram		Trans Section ···························· 39

6-20. IC Pin Function Description ········································ 40

6-21. IC Block Diagrams ······················································ 42

7.EXPLODED VIEWS

7-1. Main Section ······························································· 45

7-2. Front Panel Section ····················································· 46

7-3. Main Board Section ····················································· 47

7-4. CD Mechanism Deck Section ····································· 48

8.ELECTRICAL PARTS LIST ······································· 49

MODEL IDENTIFICATION

—BACK PANEL — PARTS No.

MODEL	PARTS No.
AR, E, E51, SP models	4-234-091-1s
AUS, KR, MX, TH models	4-234-091-7s

•Abbreviation

CND	: Canadian model	KR	: Korea model
AUS	: Australian model	MX	: Mexican model
SP	: Singapore model	AR	: Argentina model
TH	: Thai model	E51	: Chilean and Peruvian model

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