Sony MDS-JE630 Flexible Circuit Board Repairing, Notes on chip component replacement

Models: MDS-JE630

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Flexible Circuit Board Repairing

Laser component in this product is capable of emitting radia- tion exceeding the limit for Class 1.

This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PROD- UCT MARKING is located on the rear exterior.

This caution label is located inside the unit.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure.

Flexible Circuit Board Repairing

Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing.

Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

Be careful not to apply force on the conductor when soldering or unsoldering.

Notes on chip component replacement

Never reuse a disconnected chip component.

Notice that the minus side of a tantalum capacitor may be dam- aged by heat.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS

AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY.

ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ!

LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE !

SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

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Sony MDS-JE630 service manual Flexible Circuit Board Repairing, Notes on chip component replacement