Sony MDX-C5970R 2, Notes On Laser Diode Emission Check, Notes on chip component replacement

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body.

During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts.

The flexible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

Never look into the laser diode emission from right avove when checking it for adustment. It is feared that you will lose your sight.

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK (KMS-241B/J1NP).

The laser diode in the optical pick-up block may suffer electro- static break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible board. Also perform m easures against electrostatic break-down sufficiently before the operation. The flexible board is easily damaged and should be handled with care.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS

AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY.

ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ!

LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE !

SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

laser-tap

OPTICAL PICK-UP FLEXIBLE BOARD

Notes on chip component replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be dam- aged by heat.

Flexible Circuit Board Repairing

•Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing.

•Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

•Be careful not to apply force on the conductor when soldering or unsoldering.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure.

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