Sony MDX-CA680 Table of Contents General, Disassembly, Electrical Adjustments, Exploded Views

MDX-CA680/CA680X

TABLE OF CONTENTS
1. GENERAL
Location of Controls	3
Setting the Clock	4

2.DISASSEMBLY

2-1.	Disassembly Flow	10
2-2.	Sub Panel Assy	10
2-3.	Mechanism Deck (MG-164MA-138)	11
2-4.	MAIN Board	11
2-5.	Heat Sink	12
2-6.	SERVO Board	12
2-7.	MD Cover Assy	13
2-8.	Float Block	13
2-9. Lo Motor Assy (Loading) (M903)		14
2-10. Lever (LE23) Assy		14
2-11. Holder Assy		15
2-12. Chucking Arm Assy		15
2-13.	Optical Pick-up (KMS-241C)	16
2-14. SL Motor Assy (Sled) (M902),
	SP Motor Assy (Spindle) (M901)	16

3.ELECTRICAL ADJUSTMENTS

	Test Mode	17
	MD Section	17
	Tuner Section	17
4.	DIAGRAMS	18
4-1.	Block Diagram – SERVO Section –	23
4-2.	Block Diagram – TUNER Section –	24
4-3.	Block Diagram – MAIN Section –	25
4-4. Block Diagram – BUS CONTROL/
	POWER SUPPLY Section –	26
4-5. Note for Printed Wiring Boards and
	Schematic Diagrams	27
4-6. Printed Wiring Boards – SERVO Section –		29
4-7. Schematic Diagram – SERVO Section (1/2) –		30
4-8. Schematic Diagram – SERVO Section (2/2) –		31
4-9. Printed Wiring Board – MAIN Board –		32
4-10.	Schematic Diagram – MAIN Board (1/3) –	33
4-11.	Schematic Diagram – MAIN Board (2/3) –	34
4-12.	Schematic Diagram – MAIN Board (3/3) –	35
4-13.	Printed Wiring Board – SUB Board –	36
4-14.	Schematic Diagram – SUB Board –	37
4-15.	Printed Wiring Board – KEY Board –	38
4-16.	Schematic Diagram – KEY Board –	39
4-17. IC Pin Function Description		41

5.EXPLODED VIEWS

5-1.	General Section	49
5-2.	Front Panel Section	50
5-3. Mechanism Deck Section-1 (MG-164MA-138)		51
5-4.	Mechanism Deck Section-2 (MG-164MA-138)	52
6.	ELECTRICAL PARTS LIST	53

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electro- static break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body.

During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts.

The flexible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

Never look into the laser diode emission from right avove when checking it for adustment. It is feared that you will lose your sight.

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK (KMS-241C).

The laser diode in the optical pick-up block may suffer electro- static break-down easily. When handling it, perform soldering bridge to the laser-tap on the flexible board. Also perform mea- sures against electrostatic break-down sufficiently before the op- eration. The flexible board is easily damaged and should be handled with care.

laser-tap

OPTICAL PICK-UP FLEXIBLE BOARD

Notes on chip component replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be dam- aged by heat.

Flexible Circuit Board Repairing

•Keep the temperature of the soldering iron around 270 ˚C dur- ing repairing.

•Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

•Be careful not to apply force on the conductor when soldering or unsoldering.

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS

AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB- LISHED BY SONY.

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