Sony MZ-NF810 service manual Waveforms, Lead Layouts

MZ-NF810/NF810CK

6-2. Note For Printed Wiring Board And Schematic Diagrams • Waveforms

Note on Printed Wiring Board:

•X : parts extracted from the component side.

•Y : parts extracted from the conductor side.

• : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)

Caution:
Pattern face side:	Parts on the pattern face side seen from
(Conductor Side)	the pattern face are indicated.
Parts face side:	Parts on the parts face side seen from
(Component Side)	the parts face are indicated.

•MAIN board is four-layer printed board.

However, the patterns of layers 2 and 3 have not been included in this diagrams.

* Replacement of IC501,IC801 on MAIN board requires a special tool.

• Lead Layouts surface

Lead layout of conventional IC CSP (chip size package)

✩When IC851 is damaged, replace the MAIN board.

Note on Schematic Diagram:

•All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.

•All resistors are in Ω and 1/4 W or less unless otherwise specified.

•% : indicates tolerance.

•f : internal component.

•C : panel designation.

Note:	Note:
The components identified by	Les composants identifiés par
mark 0 or dotted line with mark	une marque 0 sont critiques
0 are critical for safety.	pour la sécurité.
Replace only with part number	Ne les remplacer que par une
specified.	pièce portant le numéro spécifié.

•A : B+ Line.

•Total current is measured with MD installed.

•Power voltage is dc 3 V and fed with regulated dc power supply from DC IN 3 V jack (J951).

•Voltages and waveforms are dc with respect to ground in

playback mode.

no mark : PLAYBACK

( ) : REC

∗: Impossible to measure

•Voltages are taken with a VOM (Input impedance 10 MΩ). Voltage variations may be noted due to normal produc- tion tolerances.

•Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc- tion tolerances.

•Circled numbers refer to waveforms.

•Signal path.

J : PLAYBACK

c : DIGITAL IN

F : ANALOG IN

f : RECORD

N: USB

•The voltage and waveform of CSP (chip size package) cannot be measured, because its lead layout is different form that of conventional IC.

* Replacement of IC501,IC801 on MAIN board requires a special tool.

✩When IC851 is damaged, replace the MAIN board.

•Abbreviation

3CED	:	Spanish, Swedish, Portuguese and Finnish model
4CED	:	French, German, Dutch and Italian model

1 IC501 9 (RFO)(TP1517)	4 IC601 4 (CLK)	2.4Vp-p	7 IC901 yd (CLK)	2.4Vp-p	0 IC301 q; (LRCK)
					(REC mode)
	5.67∝s		5.67∝s		22.7∝s	2.4Vp-p
500mV/DIV, 200ns/DIV 1.2Vp-p
	1V/DIV, 2∝s/DIV		1V/DIV, 2∝s/DIV		1V/DIV, 10∝s/DIV
2 IC501 rd (TE)(SL501)	5 IC801 2 (OSCO)		8 IC301 9 (MCLK)
	(at the point of R806)
780mVp-p	44.3ns	2Vp-p
500mV/DIV, 1ms/DIV			88.6ns	2.6Vp-p
	500mV/DIV, 20ns/DIV		1V/DIV, 40ns/DIV
3 IC501 rs (FE)(SL502)	6 IC801 <z,/ (UOSCO)		9 IC301 8 (BCLK)
	(USB mode)		(REC mode)
	(at the point of R823)
240mVp-p
	20.8ns	3.2Vp-p	354ns	2.6Vp-p
200mV/DIV, 1ms/DIV	1V/DIV, 10ns/DIV		1V/DIV, 100ns/DIV

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