MZ-RH910

•Note For Printed Wiring Boards and Schematic Diagrams

Note on Printed Wiring Board:

•X : parts extracted from the component side.

•Y : parts extracted from the conductor side.

•f : internal component.

• : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.)

Caution:

 

Pattern face side:

Parts on the pattern face side seen from

(Conductor Side)

the pattern face are indicated.

Parts face side:

Parts on the parts face side seen from

(Component Side)

the parts face are indicated.

 

 

*Replacement of IC401, IC501, IC601 and IC801 used in this set requires a special tool.

•MAIN board is multi-layer printed board.

However, the patterns of intermediate-layer have not been in- cluded in this diagrams.

•Lead Layouts

surface

Lead layout of conventional IC

CSP (chip size package)

Note on Schematic Diagram:

•All capacitors are in ∝F unless otherwise noted. (p: pF) 50 WV or less are not indicated except for electrolytics and tantalums.

•All resistors are in Ω and 1/4 W or less unless otherwise specified.

•f : internal component.

•C : panel designation.

Note:

Note:

The components identi-

Les composants identifiés par

fied by mark 0 or dotted

une marque 0 sont critiques

line with mark 0 are criti-

pour la sécurité.

cal for safety.

Ne les remplacer que par une

Replace only with part

pièce portant le numéro

number specified.

spécifié.

 

 

•A : B+ Line.

•Power voltage is dc 1.5 V and fed with regulated dc power supply from battery terminal.

•Voltages and waveforms are dc with respect to ground under no-signal conditions.

no mark : PLAYBACK

∗: Impossible to measure

•Voltages are taken with a VOM (Input impedance 10 MΩ). Voltage variations may be noted due to normal produc- tion tolerances.

•Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc- tion tolerances.

•Circled numbers refer to waveforms.

•Signal path.

E : PLAYBACK

j : REC

J : OPTICAL IN

F : LINE IN

d : USB input from PC

G : USB output to PC

N : MIC IN

*Replacement of IC401, IC501, IC601 and IC801 used in this set requires a special tool.

•The voltage and waveform of CSP (chip size package) cannot be measured, because its lead layout is different form that of conventional IC.

•Waveforms

– MAIN Board –

1

IC501 8 (RFO)

 

 

8 IC301 9 (MCLK)

 

(MD play mode)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.0 Vp-p

2.5 Vp-p

 

88 ns

 

 

 

500 mV/DIV, 500 ns/DIV

1 V/DIV, 50 ns/DIV

2

IC501 ra (FE)

9 IC301 q; (LRCK)

 

(MD play mode)

 

Approx.

 

 

2,3 Vp-p

280 mVp-p

22.8 ∝s

 

100 mV/DIV, 500 ns/DIV

1 V/DIV, 10

∝s/DIV

3IC501 rs (TE) (MD play mode)

Approx. 100 mVp-p

200 mV/DIV, 500 ns/DIV

4IC351 6 (MCK)

1.8 Vp-p

44.3 ns

1 V/DIV, 20 ns/DIV

6IC801 <czz (OSCO)

2.6 Vp-p 44.3 ns

1 V/DIV, 20 ns/DIV

7IC301 8 (BCLK)

2.2 Vp-p 354 ns

1 V/DIV, 100 ns/DIV

MZ-RH910

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