Star Micronics TSP700 Specifications, Options

– 11 –
Specifications
Options
(1) Wall Mount Set (WB-T700)
(2) Vertical Stand Set (VS-T700)
(3) USB Interface Board Unit (IFBD-HU03)
(4) Parallel Interface Board Unit (IFBD-HC03)
(5) 25 Pin RS-232C Interface Board Unit (IFBD-HD03)
(6) 9 Pin RS-232C Interface Board Unit (IFBD-HN03)
(7) Ethernet Interface Board Unit (IFBD-HE03)
Please access the following URL
http://www.star-micronics.co.jp/service/frame_sp_spr_e.htm
for the lastest printer drivers and utilities.
Printing method Thermal line printing
Dot density 203dpi x 203 dpi (8 dot/mm)
Printing direction Unidirectional with friction feed
Printing width Max. 80mm (640 dots)
Character per line (default) Font A: 42, Font B: 56
Character spacing (default) 0 dot
Character size Font A: 1.5 x 3.0 mm
Font B: 1.125 x 3.0 mm
Character set Alphanumeric characters: 95
International characters: 32
External graphics: 128 x 40 pages
Print speed Max. 180 mm/sec
Line spacing 3mm / 4mm
Character structure Font A: 12 x 24
Font B: 9 x 24
Interface RS232C / IEEE1284 / USB / Ethernet
Received buffer size 8K / 64 bytes
MCBF 60 million lines
(based on an average printing rate of 12.5% with
paper thickness in the range 65 µm to 75 µm)
Cutter life 1 million (65-100 µm thick paper)
0.3 million cutting (100 to 150 µm thick paper)
Temperature Operating: 5 to 45 °C
Storage: -20 to 60 °C
Humidity Operating: 10 to 90% RH (without condensation)
Storage: 10 to 90% RH (without condensation)
Dimension 147 x 213 x 148 (W x D x H mm)
Weight Approx. 1.7 Kg