Specifications, General, Dynamic-micHeadset/Handset

Specifications

General

Power Requirements:

Phantom Power: +24 VDC nominal, 175 mA

Local Power: +12 to +15 VDC, 250 mA

Dimensions: See dimension drawings.

Environmental Requirements:

Storage: -20°C to 80°C; 0% to 95% RH, non-condensing

Operating: -15°C to 60°C; 0% to 95% RH, non-condensing

Dynamic-mic Headset/Handset

Microphone: 50 to 200 ohms, dynamic (balanced or unbalanced)

Headphones: 150 to 600 ohms, monaural

Connector Type: XLR-4M

Pin 1 - Microphone Low

Pin 2 - Microhpne High

Pin 3 - Headphone High

Pin 4 - Headphone Low

Panel Microphone

Built-in Microphone:

2.2k ohms, electret (-44 dB nominal), Omnidirectional

Gooseneck Microphone:

Connector Type: ¼” Threaded TRS 5k ohms, electret (-47 dB nominal)

Tip - Microphone High (+12 VDC bias) Ring - Common

Sleeve - Common

Compatible with MCP-90 Series Microphones

Intercom Channels, Balanced mode (SW1 set to BAL position)

Output Level: 1Vrms nominal

Input Impedance: 300 ohms

Bridging Impedance: greater than 10k ohms

Sidetone: -40 dB, 35 dB adjustable range

Call Signaling:

Send: 20 kHz ±100 Hz, 0.5 Vrms ±10%

Receive: 20 kHz ±800 Hz, 100 mVrms

Mic-Kill Detect Frequency: 24 kHz ±800 Hz, 100mVrms

Noise Contribution: less than -70 dB

Common Mode Rejection Ratio: greater than 50 dB

Connector Type: Six-position push type terminal block

Pin 1 - Audio and DC Common

Pin 2 - Local power (+12 to +15 VDC) If needed

Pin 3 - Intercom channel 1 audio low and +24 VDC power

Pin 4 - Intercom channel 1 audio high and +24 VDC power

Pin 5 - Intercom channel 2 audio low and +24 VDC power

Pin 6 - Intercom channel 2 audio high and +24VDC power

Intercom Channels, Unbalanced mode (SW1 set to UNBAL position)

Output Level: 0.70 Vrms ±10%

Input Impedance: 200 ohms