Texas Instruments ADS61B23EVM, ADS61xx

6 Physical Description

6.1 PCB Layout

Physical Description

www.ti.com

This section describes the physical characteristics and PCB layout of the EVM.

The EVM is constructed on a four-layer, 0.062-inch thick PCB using FR-4 material. The individual layersare shown in Figure 2 through Figure 6 . The layout features a split ground plane; however, similarperformance can be obtained with careful layout using a common ground plane.

Figure 2. Top Silkscreen

16 SLAU206B – September 2007 – Revised April 2008Submit Documentation Feedback

Contents

Main Page Contents Page 1 Overview 1.1 ADS61xx/ADS61B23 EVM Quick-Start Procedure User's Guide Page Page 2.2.6 Jumper Selections Circuit Description Table 1. Breakout Board Pin Assignments Circuit Description Table 2. Jumpers Table 3. Surface-Mount Jumpers Page 3.2 Setting Up the EVM for ADC SPI Control 3.3 Using the TI ADC SPI Interface Software TI ADC SPI Control Interface Table 4. ADS61xx Frequently Used Registers Page 5 ADC Evaluation 5.1 Hardware Selection 5.2 Coherent Input Frequency Selection Page Page Page Page Page 6.2 Bill of Materials Table 5. Bill of Materials Remove R66 for the ADS61B23 EVM. Table 5. Bill of Materials (continued) 6.3 EVM Schematics Default:Short1-2 5234 16 8 Figure 8. EVM Schematic, Sheet 2 Default:Short2-3 Default:Short1-2 Default:Short1-2 Default:Short1-2 Figure 9. EVM Schematic, Sheet 3 Figure 10. EVM Schematic, Sheet 4 EN 3 IN 1 GND 2 OUT 5 NC/FB 4 Figure 11. EVM Schematic, Sheet 5 Figure 12. Breakout Board Schematic, Sheet 6 Page IMPORTANT NOTICE