Texas Instruments SLOU061A

EVM Component Placement

2-8 Evaluation Module Layout

2.6 EVM Component Placement

Figure 2–5 shows component placement for the EVM board.

Figure 2–5.EVM Component Placement

Contents

Main Page Preface Related Documentation From Texas Instruments FCC Warning Trademarks Page Contents Figures Table Introduction 1.1 Design Features 1.2 Power Requirements Chapter 2 Evaluation Module Layout Topic Page 2.1 Physical Considerations 2.2 Area 100Single Device SOIC Figure 21.Area 100 SchematicSingle Device, SOIC (8 pin) Physical Considerations 2-4 Evaluation Module Layout 2.3 Area 200Dual Device SOIC Figure 22.Area 200 SchematicDual Device, SOIC (14 pin) 2.4 Area 300Quad Device SOIC Physical Considerations 2-6 Evaluation Module Layout Figure 23.Area 300 SchematicQuad Device SOIC (16 pin) 2.5 General Power Dissipation Considerations Figure 24.Maximum Power Dissipation vs Free-Air Temperature Table 21.Dissipation Rating Table Page Page Page Chapter 3 Example Circuits Topic Page Schematic Conventions 3-2 Example Circuits 3.1 Schematic Conventions 3.2 Inverting Amplifier Figure 31.Inverting Amplifier With Dual Supply Using Area 100 Noninverting Amplifier () 6 100 k 3 + () Figure 33.Single Operational Amplifier Differential Amplifier With Single Supply Using Area 100 Sallen-Key Low-Pass Filter 3-5 3.5 Sallen-Key Low-Pass Filter Qf 1 1f f 2j f Where: fo1 2mnRC And Qmn m 1 3.6 Sallen-Key High-Pass Filter Sallen-Key High-Pass Filter 3-7 Figure 35.Sallen-Key High-Pass Filter With Single Supply Using Area 200 3.7 Two Operational Amplifier Instrumentation Amplifier Two Operational Amplifier Instrumentation Amplifier 3-9 Figure 36.Two Operational Amplifier Instrumentation Amplifier Wwith Single Supply Using Area 200 3.8 Quad Operational Amplifier Instrumentation Amplifier Quad Operational Amplifier Instrumentation Amplifier 3-11 Figure 37.Quad Operational Amplifier Instrumentation Amplifier With Dual Supply Using Area 300