Texas Instruments manual 3.8 TPA005D12 Class-DEVM Bill of Materials, Details

TPA005D12 Class-D EVM Bill of Materials

3.8 TPA005D12 Class-D EVM Bill of Materials

The components in the bill of materials (Table 3±5) were selected for their common values, availability, and the smallest size available to meet these criteria.

Table 3±5. TPA005D12 Class-D EVM Bill of Materials

Reference

Description

Size

EVM

Qty.

Manufacturer/ Part Number

C17	Capacitor, Ceramic Chip, 0.1 ∝F, ±10%,	0805	1	Kemet
	50 V, X7R			C0805C104K5RAC
C1, C2, C3, C4,	Capacitor, Ceramic Chip, 1 ∝F, ±10%,	1206	10	TDK
C8, C10, C11,	16 V, X7R			C3216X7R1C105K
C15, C16, C24,
C25
C18, C19	Capacitor, Ceramic Chip, 47 nF, ±10%,	0805	2	Kemet
	50 V, X7R			C0805V473K5RAC
C5, C6, C7	Capacitor, Ceramic Chip, 470 pF, ±5%,	0805	3	Kemet
	50 V, C0G,			C0805C471J5GAC
C9, C12	Capacitor, Ceramic Chip, 10 ∝F, +80%±20%,	1210	2	muRata
	25 V, Y5V			GRM235Y5V106Z25
C13, C14	These pads are provided for increase of bulk	0.0236º ⋅
	capacitance as required to meet voltage ripple	0.138º
	and temperature operating range specifications.
C20, C21, C22,	Capacitor, Ceramic Chip, 0.22 ∝F, ±10%,	1206	4	Kemet
C23	16 V, X7R			C1206C224K4RAC
L1, L2, L3, L4	Inductor, SMT, 15 ∝H, ±20%, 2.2 ADC, 47.2 mΩ	0.398º ⋅ 0.398º	4	TDK
	@ 1 kHz, ±20 to +90°C	⋅ 0.220º		SLF10145±150
L1, L2, L3, L4	Inductor, SMT, 15 ∝H, ±20%, 1.1 ADC, 75 mΩ	0.276º ⋅ 0.276º	4	TDK
Alternate Value	@ 1 kHz, ±20 to +85°C	⋅ 0.126º		SLF7032±150
R1, R2	Resistor, Thick Film Chip, SMD, 100 kΩ, ±5%,	0603	2	Vishay/Dale
	1/16 W, 150 V, ±50 to 150°C, ±200 ppm/°C			CRCW0603104J
	Headers, 0.100 in. centers, 1/2 in length	0.5º, 0.25º,	14	Samtec
		0.1º		TSW±19±8±G±S
TP1, TP2, TP3,	Test Point, Red		10	Farnell
TP5± TP11				240±345
TP4, TP12	Test Point, Black		2	Farnell
				240±333
S1, S2	Switch, Momentary, Push Button, 12 VDC,	0.291º ⋅ 0.138º	2	Panasonic
	50 mA	⋅ 0.134º		EVQ-PJS04K
U1	IC, Audio amplifier, class-D,	TSSOP48	1	TI
	2 W, 48 pin, DCA pkg			TPA005D12DCA

Details 3-25