The TPA0202 Audio Power Amplifier Evaluation Module
3-4
Details
Figure 3–3.TPA0202 EVM Schematic Diagram
GND/HSGND/HS
S2
NCNC
ROUT+LOUT+
RLINE INLLINE IN
HP/LINEMUTE OUT
ROUT–LOUT–
SE/BTLMUTE IN
GND/HSGND/HS
RHP INLHP IN
RBYPASSLBYPASS
RVDD
LVDD
NCSHUTDOWN
10
9
12
11
6
5
8
7
2
1
4
3
23
22
21
20
19
18
17
16
15
14
13
24
R6
100 kΩ
R4
20 kΩ
R3
20 kΩ
C2
1 µF
C1
1 µFR1
20 kΩ
R2
50 kΩ
C3
5 pF
LVDD
S7
LVDD R13
510 Ω
D1
R5
100 kΩ
C12
10 µF
C5
2.2 µF
S1
S8
LOUT–
MUTE IN
LIN
LHP
LVDD
LOUT+
R10
20 kΩC7
1 µF
C4
2.2 µFC9
2.2 µF
R9
20 kΩ
R7
50 kΩ
C8
5 pF
C6
1 µF
R8
20 kΩ
S3
LVDD
R11
100 kΩ
S4
LVDD
R12
100 kΩ
S6
ROUT+
RIN
RHP
RVDD
HP/LINE
ROUT–
SE/BTL
S5
LVDD
C10
2.2 µFC11
10 µF
TPA0202

3.2.1 TPA0202 Audio Amplifier IC

The TPA0202 audio amplifier IC is a CMOS device intended primarily for

bridge-tied load (BTL) operation in battery-powered applications. It is supplied

in a very small 24-pin TSSOP thermal surface-mount package and has been

designed to operate from low supply voltages (between approximately 3 V and

5.5 V) and deliver full power at distortion levels of less than 0.1% THD+N from

a 5-V supply (Figure 3–4). Typical applications include portable computers

and multimedia systems.