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TOA Electronics
THS4130
manual
±9. Internal Plane Layer 2 Ground Plane
Models:
THS4130
1
14
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Specifications
THS4130 EVM Schematic
±2. Signal Connections
Power Supply Setup
Power Down Verification
Evaluation Module Features
Using the THS4130 EVM
Page 14
Image 14
THS4130 EVM Layout
Figure 1±9. Internal Plane (Layer 2) (Ground Plane)
Figure 1±10. Internal Plane (Layer 3) (
±
V
CC
Plane)
1-8
Introduction and Description
Page 13
Page 15
Page 14
Image 14
Page 13
Page 15
Contents
Users Guide
Important Notice
Preface
Trademarks
Contents
Figures
Introduction and Description
Evaluation Module Features
Description
THS4130 EVM Specifications
Schematic of the Populated Circuit Default Configuration
THS4130 EVM Schematic
±2. Schematic
Additional Sample Schematics
±5. Vicr Level Shifter
THS4130 EVM Layout
±7. Top Layer Silkscreen
±9. Internal Plane Layer 2 Ground Plane
±11. Bottom Layer 4 Ground and Signal
Introduction and Description
Using the THS4130 EVM
Power Supply Setup
Required Equipment
Input and Output Setup
±2. Signal Connections
Testing the EVM Setup
±3. Driver 1 Output Signal
Power Down Verification
Measuring the Frequency Response
Butterworth Filter
Butterworth Filter
THS4130 EVM Bill of Materials
±1. THS4130 EVM Bill of Materials
P374CTR±ND
General High-Speed Amplifier Design Considerations
General High-Speed Amplifier Design Considerations
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