2. SPECIFICATIONS

EM1-33046A

2.3 MEDIA

2.3 MEDIA

 

Item

 

 

 

 

Type

Thermal Label

Tag Paper

 

Width (mm)

 

 

 

 

 

25.0 ~ 115.0

25.0 ~ 115.0

 

Length (mm)

 

 

 

 

 

12.0 ~ 273.0

12.0 ~ 273.0

 

Thickness (mm)

0.08 ~ 0.46

0.16 ~ 0.32

 

Inner roll diameter (mm)

 

 

 

 

 

 

 

 

110.0 max.

 

External roll diameter (mm)

 

 

 

 

 

 

 

 

214.0 max.

1)

Thermal Label

 

 

 

 

 

 

 

 

 

 

 

<Design>

2.5 mm ~ 5.0 mm

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Backing

 

 

 

 

 

 

 

 

 

 

12.0 mm ~ 273.0 mm

 

 

 

 

 

 

 

 

 

 

 

 

Paper

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Label

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.0 mm

 

 

 

 

 

 

 

 

 

1.0 mm

BackingPaper

 

 

 

 

 

 

 

 

 

 

 

Fig. 2-1

 

 

 

 

23.0 mm~113.0 mm

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2)

Tag Paper

 

 

25.0 mm~115.0 mm

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Sensing Hole

 

 

 

 

 

 

<Design>

2.5 mm ~ 5.0 mm

12.0 mm ~ 273.0 mm

Print Side

Fig. 2-3

25.0 mm~115.0 mm

 

3) Ticket

Black Line

 

 

<Design>

3.0 mm ~ 30.0 mm 12.0 mm ~ 273.0mm

Print Side

Fig. 2-525.0 mm~115.0 mm

Ticket

25.0~ 115.0

12.0~ 273.0

0.16~ 0.32

25.7 ± 0.3 mm

Label

Fig. 2-2

25.7 ± 0.3 mm

Fig. 2-4

25.7 ± 0.3 mm

Fig. 2-6

2-3

Page 11
Image 11
Toshiba EM1-33046AE, B-442-QP owner manual Media, 525.0 mm~115.0 mm

B-442-QP, B-442, EM1-33046AE, EM1-33046A specifications

The Toshiba EM1-33046A and EM1-33046AE are advanced semiconductor devices primarily designed for high-performance applications. These models are part of Toshiba's broader portfolio, which emphasizes cutting-edge technology and reliability. The EM1-33046A offers impressive operational capabilities and is well-regarded for its low power consumption, making it ideal for energy-sensitive applications.

One of the distinguishing features of the EM1-33046A and its variant, the EM1-33046AE, is their robust operational range. They are engineered to handle varying voltage levels efficiently while maintaining performance stability. This adaptability is crucial in fields such as automotive electronics, industrial automation, and consumer electronics, where devices must operate under diverse conditions. Furthermore, these components are built with integrated protective mechanisms, enhancing their reliability and longevity.

Complementing these models are the B-442 and B-442-QP series. The B-442 is known for its exceptional power management capabilities. It features an advanced architecture that optimizes the distribution of power across multiple channels, ensuring that electronic systems run smoothly and efficiently. The B-442-QP variant, on the other hand, introduces enhanced performance metrics, offering quicker response times and improved thermal management. This makes it perfect for applications that require rapid processing and minimal heat generation.

Both the B-442 and B-442-QP benefit from Toshiba's innovative power semiconductor technology. They utilize cutting-edge fabrication techniques, resulting in high-efficiency performance while minimizing energy waste. The devices are also designed with advanced thermal characteristics, allowing them to operate at higher temperatures without compromising functionality.

In summary, the Toshiba EM1-33046A, EM1-33046AE, B-442, and B-442-QP series are engineered for high performance and efficiency. Their unique combination of features makes them suitable for various applications, including automotive, industrial, and consumer electronics. These models not only showcase Toshiba's commitment to innovation but also their dedication to providing reliable, energy-efficient solutions for modern electronic systems. The integration of these technologies positions Toshiba as a leader in the semiconductor industry, meeting the evolving demands of a wide range of applications.